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Product Overview
Digi-Key Part Number BER166-ND
Quantity Available 3,144
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-05

Description THERM PAD TO-3 W/ADH HI-FLOW
Expanded Description Thermal Pad Gray 41.91mm x 28.95mm Rhombus Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Product Attributes Select All
Categories
Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-3
Shape Rhombus
Outline 41.91mm x 28.95mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER166
HF115AC-05
HF115AC00055AC05
HF115TAAC-05

22:54:30 2/24/2017

Price & Procurement
 

Quantity
All prices are in NZD.
Price Break Unit Price Extended Price
1 0.44000 0.44
10 0.38400 3.84
50 0.34340 17.17
100 0.30380 30.38
500 0.26418 132.09
1,000 0.19814 198.14
5,000 0.17172 858.59

Submit a request for quotation on quantities greater than those displayed.

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