Add To Favorites
Product Overview
Digi-Key Part Number BER167-ND
Quantity Available 3,874
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-54

Description THERM PAD TO-220 W/ADH HI-FLOW
Expanded Description Thermal Pad Gray 19.05mm x 12.70mm Rectangle Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Product Attributes Select All
Categories
Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Shape Rectangle
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
You May Also Be Interested In
Additional Resources
Standard Package ? 100
Other Names BER167
BG426641
HF115AC-54
HF115AC00055AC54
HF115TAAC-54

23:43:10 2/25/2017

Price & Procurement
 

Quantity
All prices are in NZD.
Price Break Unit Price Extended Price
1 0.16000 0.16
10 0.13500 1.35
50 0.12120 6.06
100 0.10720 10.72
500 0.09324 46.62
1,000 0.06993 69.93
5,000 0.06061 303.03

Submit a request for quotation on quantities greater than those displayed.

Send Feedback