Quick Dive Information on the Latest Product Additions and New Components.
Delta's frameless fans series is available in blower, mixed-flow, and axial models that work well for space-constrained and noise-sensitive applications.
Check out Advanced Thermal Solutions wide array of heat sinks including the largest selection of pushPIN™ heat sinks on the market to cover your board.
3M™ AF42 thermal bonding film is an epoxy, thermoset film adhesive developed for structural bonding of metal, glass and other engineering grade substances.
Wakefield-Vette’s Peltier thermoelectric coolers can meet the requirement of higher current and large cooling needs.
Ohmite's powerful forged pin heatsink for TO-220, TO-247, and TO-264 devices is designed to be through-hole soldered to the PCB for forced convection cooling.
Ohmite's CA series heatsinks are securely mounted to PCBs with through-hole soldering of the integrated solder feet.
Mechatronics' low-power fans provide the efficiency of a DC fan with the simplicity of connecting to an AC power supply.
3M™ 9876 thermally conductive and heat spreading tape provides heat dissipation with a preferential heat-transfer path through heat-generating components.
Wakefield-Vette’s HPLC-RM series is a refrigerant-free temperature control device mountable in a 19-inch rack.
Delta's commercial refrigerator fans and motors provide outstanding reliability and improved power efficiency compared to traditional AC fans and motors.
CUI's AF and SF series of thermal conductive pads offer packages from 10 mm x 10 mm to 70 mm x 70 mm and are designed with non-silicone or silicone elastomer.
Mechatronics fan trays deliver high airflow and low power consumption rack mountable thermal management solutions.
Taica’s COH-3114LVC thermal interface sheet material (TIM) is available in a variety of thicknesses and can be custom-cut to fit any design or application.
Orion’s LFG heavy-duty filter fan kit series prevents dust, dirt and moisture from entering enclosures available in a variety of options and fan sizes.
CUI's HSS series of heat sinks features high thermal conductivity to improve heat dissipation and are available with and without solder pins.
Orion Fans are designed for use in equipment where permanent, cleanable filters are most appropriate, such as networking, telecom and communications enclosures.
Explore Panasonic technologies like active and passive components, energy solutions, industrial automation and more.
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
3M™ series 8926 thermally conductive interface tapes are filled with conductive ceramic particles for good converting availability, handling, and reworkability.
Parker Chomerics' THERM-A-GAP™ 974 is supplied with pressure sensitive adhesive for ease of use.
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