Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension
DIP-ADAPTER-EVM MODULE EVAL DIP ADAPTER Texas Instruments	277 In Stock	1 : $21.24000 Box	-	Box	Active	SMD to Plated Through Hole	MSOP, SC70, SOIC, SOT23, SOT563, TSSOP	6	-	-	-	-
5-8-LOGIC-EVM LOGIC EVAL BOARD Texas Instruments	169 In Stock	1 : $22.33000 Box	-	Box	Active	SMD to Plated Through Hole	SC-70, SOT-23, SOT-583, SSOP, VSSOP	8	-	-	-	-
14-24-LOGIC-EVM DEVELOPMENT SPECIALIZED Texas Instruments	141 In Stock	1 : $22.33000 Box	-	Box	Active	SMD to Plated Through Hole	SOIC, TSSOP	-	-	-	-	-
SMALL-AMP-DIP-EVM BREAKOUT BOARD Texas Instruments	29 In Stock	1 : $44.66000 Box	-	Box	Active	SMD to DIP	DPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-16	16	-	-	-	-
SOIC-ADAPTER-EVM UNPOPULATED EVALUATION MODULE FO Texas Instruments	21 In Stock	1 : $44.66000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-
TSSOP-VSSOP-ADAPTE UNPOPULATED EVALUATION MODULE FO Texas Instruments	8 In Stock	1 : $44.66000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-
QUAD-TSSOP-ADAPTER UNPOPULATED EVALUATION MODULE FO Texas Instruments	1 In Stock	1 : $44.66000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-

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Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.