DS90UB954-Q1EVM Quick Start Guide Datasheet by Texas Instruments
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User’s Guide
DS90UB95x-Q1EVM Deserializer User's Guide
Liam Keese
ABSTRACT
The Texas Instruments DS90UB95x-Q1EVM evaluation modules (EVM) are functional board designs for
evaluating the DS90UB95x-Q1 FPD-Link III and TDES954 V3Link deserializers, which convert serialized camera
data to MIPI CSI-2 for processing. The MIPI CSI-2 output has four available lanes, and can be configured for
either four-lane output or replicated two-lane output. When paired with a compatible serializer, the deserializers
receive data from imager(s) supporting cameras as well as satellite RADAR. The DS90UB954-Q1 also supports
DS90UB913A/933 serializers.
Some variants are single channel; for these variants ignore references to RX1. Some references are made to
serializer backward compatibility; refer to the product datasheet for serializer compatibility.
The DS90UB954-Q1EVM is configured for communication with DS90UB953-Q1 and TSER953 on channel
0 (RX0), and DS90UB933-Q1 on channel 1 (RX1). The EVM has two Rosenberger FAKRA connectors and
configurable Power-over-Coax (PoC) voltage for connecting the camera modules (not included). FPD-Link III
and V3Link interfaces also include a separate low latency bidirectional control channel that conveys control
information from an I2C port. General purpose I/O signals, such as those required for camera synchronization
and functional safety features, also make use of this bidirectional control channel to program registers in the
DS90UB954-Q1 and TDES954, as well as the connected serializer and any remote I2C connected devices.
There is an onboard MSP430 which functions as a USB2ANY bridge for interfacing with a PC for evaluation. The
USB2ANY interfaces with the Analog LaunchPAD GUI tool.
Table of Contents
1 Trademarks..............................................................................................................................................................................4
2 Introduction.............................................................................................................................................................................4
3 Quick Start Guide....................................................................................................................................................................5
3.1 System Requirements........................................................................................................................................................5
3.1.1 Included Components..................................................................................................................................................5
3.1.2 Additional Required Components................................................................................................................................5
3.2 Applications Diagram......................................................................................................................................................... 5
3.3 Major Components of DS90UB95x-Q1EVM...................................................................................................................... 5
3.4 DS90UB95x-Q1EVM Setup............................................................................................................................................... 6
4 DS90UB95x-Q1EVM Board Configuration............................................................................................................................6
4.1 Default Configuration......................................................................................................................................................... 6
4.2 Power Supply..................................................................................................................................................................... 7
4.3 Power-over-Coax Interface................................................................................................................................................ 7
4.4 MIPI CSI-2 Output Signals................................................................................................................................................. 8
4.5 FPD-Link III Signals......................................................................................................................................................... 10
4.6 I2C Interface..................................................................................................................................................................... 10
4.7 Control Interface...............................................................................................................................................................11
5 Enable and Reset..................................................................................................................................................................12
6 Use with DS90UB936-Q1......................................................................................................................................................12
7 Typical Connection and Test Equipment............................................................................................................................13
8 Termination Device...............................................................................................................................................................13
9 Typical Test Setup.................................................................................................................................................................13
10 Equipment References.......................................................................................................................................................14
11 Cable References................................................................................................................................................................14
12 Software for DS90UB95xQ1-EVM Evaluation - Analog LaunchPAD (ALP) Software Setup........................................ 15
12.1 System Requirements....................................................................................................................................................15
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12.2 Download Contents........................................................................................................................................................15
12.3 Installation of the ALP Software..................................................................................................................................... 15
12.4 Startup - First Launch.....................................................................................................................................................16
13 Using ALP and DS90UB95x Profile...................................................................................................................................20
13.1 Information Tab.............................................................................................................................................................. 20
13.2 Registers Tab................................................................................................................................................................. 21
13.3 Registers Tab - Address 0x00 Expanded.......................................................................................................................22
13.3.1 Port Specific Registers............................................................................................................................................ 22
13.4 Saving and Loading Register Settings........................................................................................................................... 22
13.5 Scripting Tab.................................................................................................................................................................. 26
13.5.1 Example Functions.................................................................................................................................................. 28
13.6 GPIO Tab....................................................................................................................................................................... 30
13.7 Forwarding Tab.............................................................................................................................................................. 31
13.8 CSI Registers Tab.......................................................................................................................................................... 32
13.9 Remote Registers Tab....................................................................................................................................................33
14 Troubleshooting ALP Software......................................................................................................................................... 34
14.1 ALP Does Not Detect The EVM..................................................................................................................................... 34
14.2 USB2ANY Firmware Issues........................................................................................................................................... 35
15 DS90UB95x-Q1EVM PCB Schematics, Layout and Bill of Materials - DS90UB95x-Q1EVM Schematic..................... 37
16 DS90UB95x-Q1 EVM PCB Layout..................................................................................................................................... 45
17 DS90UB95xQ1-EVM Bill of Materials................................................................................................................................ 55
18 Revision History................................................................................................................................................................. 60
List of Figures
Figure 2-1. DS90UB95x-Q1EVM.................................................................................................................................................4
Figure 3-1. Applications Diagram................................................................................................................................................ 5
Figure 3-2. Interfacing to the EVM...............................................................................................................................................5
Figure 4-1. DS90UB95x-Q1EVM with Jumpers Highlighted........................................................................................................6
Figure 4-2. Power-over-Coax Network For Use With DS90UB953............................................................................................. 7
Figure 4-3. Power-over-Coax Network For Use With DS90UB933............................................................................................. 8
Figure 9-1. Typical Test Setup for Evaluation............................................................................................................................ 13
Figure 12-1. Launching ALP Splash Screen..............................................................................................................................16
Figure 12-2. Initial ALP Screen..................................................................................................................................................16
Figure 12-3. Select USB2ANY/Aardvark Setup to Change Profile............................................................................................ 17
Figure 12-4. ALP Profiles Dialog............................................................................................................................................... 18
Figure 12-5. ALP Profiles Dialog (continued)............................................................................................................................ 19
Figure 13-1. ALP Information Tab..............................................................................................................................................20
Figure 13-2. ALP Registers Tab.................................................................................................................................................21
Figure 13-3. ALP Device ID Expanded......................................................................................................................................22
Figure 13-4. Save Register Settings Step 1.............................................................................................................................. 23
Figure 13-5. Save Register Settings Step 2.............................................................................................................................. 23
Figure 13-6. Save Register Settings Step 3.............................................................................................................................. 24
Figure 13-7. Load Register Settings Step 1...............................................................................................................................24
Figure 13-8. Load Register Settings Step 2...............................................................................................................................25
Figure 13-9. Load Register Settings Step 3...............................................................................................................................25
Figure 13-10. ALP Scripting Tab................................................................................................................................................26
Figure 13-11. Pre-Defined Scripts..............................................................................................................................................27
Figure 13-12. Custom Button Creation Step 1...........................................................................................................................27
Figure 13-13. Custom Button Creation Step 2...........................................................................................................................28
Figure 13-14. GPIO Tab.............................................................................................................................................................30
Figure 13-15. Forwarding Tab....................................................................................................................................................31
Figure 13-16. CSI Registers Tab............................................................................................................................................... 32
Figure 13-17. Remote Registers Tab.........................................................................................................................................33
Figure 14-1. ALP No Devices Error........................................................................................................................................... 34
Figure 14-2. Windows 7, ALP USB2ANY Driver........................................................................................................................34
Figure 14-3. ALP in Demo Mode............................................................................................................................................... 35
Figure 14-4. ALP Preferences Menu......................................................................................................................................... 35
Figure 14-5. USB2ANY Firmware Update Notice......................................................................................................................36
Figure 14-6. USB2ANY Firmware Update Procedure............................................................................................................... 36
Figure 15-1. DS90UB95x-Q1EVM Block Diagram.................................................................................................................... 37
Figure 15-2. DS90UB95x-Q1EVM Main Circuit - Page 1.......................................................................................................... 38
Figure 15-3. DS90UB95x-Q1EVM CSI-2 Connectors - Page 2.................................................................................................39
Figure 15-4. DS90UB95x-Q1EVM PoC Circuits - Page 3......................................................................................................... 40
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Figure 15-5. DS90UB95x-Q1EVM Power Distribution Circuits - Page 4................................................................................... 41
Figure 15-6. DS90UB95x-Q1EVM LED Circuits - Page 5......................................................................................................... 42
Figure 15-7. DS90UB95x-Q1EVM USB2ANY Circuits - Page 6............................................................................................... 43
Figure 15-8. DS90UB95x-Q1EVM Miscellaneous Hardware.................................................................................................... 44
Figure 16-1. Top View Composite..............................................................................................................................................45
Figure 16-2. Layer 1: Top Signal Layer......................................................................................................................................46
Figure 16-3. Layer 2: GND Plane 1........................................................................................................................................... 47
Figure 16-4. Layer 3: Mid Signal Layer 1...................................................................................................................................48
Figure 16-5. Layer 4: GND Plane 2........................................................................................................................................... 49
Figure 16-6. Layer 5: GND Plane 3........................................................................................................................................... 50
Figure 16-7. Layer 6: Mid Signal Layer 2...................................................................................................................................51
Figure 16-8. Layer 7: GND Plane 4........................................................................................................................................... 52
Figure 16-9. Layer 8: Bottom Signal Layer................................................................................................................................ 53
Figure 16-10. Bottom View Composite...................................................................................................................................... 54
List of Tables
Table 4-1. Power Supply..............................................................................................................................................................7
Table 4-2. Power-over-Coax Power Supply Feed Configuration................................................................................................. 8
Table 4-3. MIPI CSI-2 Output Signals - J5 and J6 Pinout............................................................................................................9
Table 4-4. FPD-Link III Signals.................................................................................................................................................. 10
Table 4-5. IDx I2C Device Address Select - J23........................................................................................................................ 10
Table 4-6. I2C Interface Header - J25........................................................................................................................................ 10
Table 4-7. VDDIO Interface Header - J16.................................................................................................................................. 11
Table 4-8. GPIO Interface Header - J22.....................................................................................................................................11
Table 4-9. CMLOUT Output Signals...........................................................................................................................................11
Table 4-10. FPD-Link III Mode Control- J15...............................................................................................................................11
Table 4-11. Device Mode Control - J11...................................................................................................................................... 11
Table 4-12. LEDs....................................................................................................................................................................... 12
Table 17-1. DS90UB95x-Q1EVM BOM..................................................................................................................................... 55
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1 Trademarks
All trademarks are the property of their respective owners.
2 Introduction
Note
The demo board is not optimized for EMI testing. The demo board was designed for easy accessibility
to device pins with tap points for monitoring or applying signals, additional pads for termination, and
multiple connector options.
Figure 2-1. DS90UB95x-Q1EVM
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3 Quick Start Guide
3.1 System Requirements
3.1.1 Included Components
The major components of the DS90UB95x-Q1EVM are:
• DS90UB95x-Q1
• On-board Power-over-Coax (PoC) interface
• FAKRA coax connector(s) for digital video, power, control and diagnostics
• Samtec QSH type connector for CSI-2 interface
• On-board I2C programming interface
3.1.2 Additional Required Components
To demonstrate the functionality of the DS90UB95x-Q1, the following components are required (not included):
• One compatible serializer.
• One DACAR/FAKRA coax cable
• USB to mini USB cable OR I2C host controller that supports clock stretching (such as USB2ANY)
• Power supply for 12V @ 1A (current limited bench supply recommended)
• Optional: MIPI CSI-2 output analyzer or host processor
3.2 Applications Diagram
DS90UB954-Q1
Deserializer
DS90UB933
Serializer
CSI-2
Tx Port
RAW 10/12
MIPI CSI-2
1.6 Gbps/lane X 4 Host / ISP
DS90UB953
Serializer
MIPI CSI-2
3.2 Gbps
Figure 3-1. Applications Diagram
3.3 Major Components of DS90UB95x-Q1EVM
Figure 3-2. Interfacing to the EVM
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3.4 DS90UB95x-Q1EVM Setup
1. Use the mini USB to USB cable to connect J2 to computer USB port for register programming and open
Analog LaunchPAD. See Section 12 for details on installing and using Analog LaunchPAD.
2. Configure jumpers J8, J10, J11, J15, J16, J23, J27 to set device’s operating modes. The default
configuration can be seen in Figure 4-1.
3. Configure Power-over-Coax power supplies for RX0 and RX1 with J18 and J17 respectively.
4. Connect the DS90UB95x-Q1EVM to DS90UB953-Q1EVM (or variant) to RX0 and/or DS90UB933-Q1EVM
to RX1 using a coax cable.
5. Interface MIPI CSI-2 output signals (J24) to test equipment or host processor (optional, not required to check
status of FPD-Link III connection between serializer and deserializer).
6. Provide power to board. TI recommends using current limited bench supply to provide power to J1 (barrel
jack) or J3.
4 DS90UB95x-Q1EVM Board Configuration
4.1 Default Configuration
Default jumper placement shown in red. This configuration sets the device into the following mode
• Device is set for FPD-Link III inputs from coax in CSI mode (for DS90UB953-Q1EVM (or variant))
• VDDIO is set to 1.8V
• VDD5V is powered by the 5V LDO
• The 3.3V + 1.1V LDO (U10) is powered by VDD5V
• The 9V LDO for PoC for RX0 and RX1 are enabled
Figure 4-1. DS90UB95x-Q1EVM with Jumpers Highlighted
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Table 4-1. Power Supply
Reference Signal Description
J1/J3 +12V
Main Power
Single +12VDC (nominal) power connector that supplies power to
the entire board.
4.3 Power-over-Coax Interface
The DS90UB95x-Q1EVM offers two Power-over-Coax interfaces (PoC) to connect cameras through a coaxial
cable with FAKRA connectors. Power is delivered on the same conductor that is used to transmit video and
control channel data between the host and the camera. By default, 5V power supply is applied over the coax
cable. Refer to for other PoC configurations.
Note
For port RX0, the PoC network is configured for a DS90UB953-Q1EVM (or variant), and for RX1 the
PoC network is configured for a DS90UB933-Q1. Only use a serializer EVM with the correct PoC
network. To use PoC with two DS90UB953-Q1EVM (or variant) or DS90UB933-Q1 EVM's, one of the
PoC networks must be reworked. You may also open the PoC circuit and power the serializer EVM
directly from another supply.
For Power-over-Coax (PoC) on the EVM, the circuit uses a filter network as shown in Figure 4-3. The PoC
network frequency response corresponds to the bandwidth compatible with DS90UB953-Q1EVM (or variant)
chipsets.
Figure 4-2. Power-over-Coax Network For Use With DS90UB953
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Figure 4-3. Power-over-Coax Network For Use With DS90UB933
WARNING
Verify that the Power-over-Coax voltage is properly set before plugging into RX0 or RX1. Power
supply is not fused. Over-voltage will cause damage to boards directly connected due to incorrect
input power supplies. DS90UB913A-Q1EVM is designed for a maximum of 5V PoC. To use
DS90UB913A-Q1EVM with DS90UB954-Q1EVM, open J17 or J18 to disable PoC, and either
power the DS90UB913A-Q1EVM separately or by applying 5V to the J17 or J18 pin on DS90UB954-
Q1EVM.
Table 4-2. Power-over-Coax Power Supply Feed Configuration
Reference Signal Description
J18 VPOC_RX0
This sets the voltage for Power-over-Coax on RX0
Jumper installed: +9V power supply from VPOC_LDO0_9V
Jumper Open: No PoC connected. Apply power to pin1 or leave open and power serializer
separately.
J17 VPOC_RX1
This sets the voltage for Power-over-Coax on RX1
Jumper installed: +9V power supply from VPOC_LDO1_9V
Jumper Open: No PoC connected. Apply power to pin1 or leave open and power serializer
separately.
4.4 MIPI CSI-2 Output Signals
There are two options provided for passing out the deserialized data on the DS90UB95x-Q1EVM . The first
is a Samtec QSH-type connector, J24, on the top of the board that can be mated with a matching QTH type
connector. The mating connector part number for the J24 connector is QTH-020-01-H-D-DP-A. On the bottom
of the board is a Samtec QTH-type connector, J26, meant for mating with a TDAx evaluation kit. The signals
to the connectors are the same, including access to I2C and other signals including PDB and GPIO. Only one
connector should be used at a time. If the J6 connector on the bottom is to be used, populate the zero ohm
resistors on the bottom of the board which extend the traces to the J26 connector.
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There are third party solutions like the HDR-128291-XX breakout board from Samtec which can be used. The
HDR- 128291-XX is a breakout board with a mating connector to J24 or J26, providing access to each pin
through standard SMA male connectors. More info on this breakout board can be obtained from Samtec website.
Another third party option is the ZX100 by Zebax Technologies. More information on this board can be obtained
from Zebax website.
Table 4-3. MIPI CSI-2 Output Signals - J5 and J6 Pinout
Pin # Signal Name Pin # Signal Name
1 NC 2 EXP_SCL
(I2C_SCL or I2C_SCL2)
3 NC 4
EXP_SDA
(I2C_SDA or
I2C_SDA2)
5 CSI_CLK0_P 6 NC
7 CSI_CLK0_N 8 NC
9 CSI_D0_P 10 EXP_REF_CLK
(REFCLK)
11 CSI_D0_N 12 GND
13 CSI_D1_P 14 RESET
(PDB)
15 CSI_D1_N 16 GND
17 CSI_D2_P 18 SPI_MOSI
(GPIO0 or GPIO3)
19 CSI_D2_N 20 SPI_SCLK
(GPIO1 or GPIO4)
21 CSI_D3_P 22 SPI_CS
(GPIO2 or GPIO5)
23 CSI_D3_N 24 GND
25 CSI_CLK1_P 26 NC
27 CS_CLK1_N 28 NC
29 NC 30 VDD_3V3
31 NC 32 VDD_3V3
33 NC 34 VDD_3V3
35 NC 36 VDD_3V3
37 NC 38 VDD_1V8
39 NC 40 VDD_1V8
Note
Populate R60-R69, R71,R72 (0Ω resistors) only when using the J26 connector on the bottom of the
board. Do not use J24 and J26 connectors at the same time.
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4.5 FPD-Link III Signals
Table 4-4. FPD-Link III Signals
Reference Signal Description
RX0p RIN0+ FAKRA connector for DS90UB953-Q1EVM (or variant) serializer
RX0n RIN0- FAKRA connector footprint for use with STP applications.
RX1 RIN1+ FAKRA connector for DS90UB933-Q1 serializer
4.6 I2C Interface
In addition to the on-board USB2ANY controller accessible via the mini-USB port, a standalone external I2C host
can connect via J25 for programming purposes. Examples of external I2C host controllers are Texas Instruments
USB2ANY and Total Phase Aardvark I2C/SPI host adapter (Total Phase Part#: TP240141).
When the I2C interface is accessed through connector J25, I2C signal levels can be configured through J16 to
be at 1.8V or 3.3V. Optional access to I2C signals are also available via CSI-2 connectors J24 (top) and J26
(bottom).
Table 4-5. IDx I2C Device Address Select - J23
Reference Signal Description
J23 IDX Select
Selects I2C Device Address
Open: 0x30 (7'b) or 0x60 (8'b)
Short: 0x3D (7'b) or 0x7A (8'b) (Default)
Table 4-6. I2C Interface Header - J25
Reference Signal Description
J25.1 VDDIO I2C bus voltage (tied to VDDIO)
J25.2 I2C_SCL I2C Clock Interface for I2C bus
J25.3 I2C_SDA I2C Data Interface for I2C bus
J25.4 GND Ground
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4.7 Control Interface
Table 4-7. VDDIO Interface Header - J16
Reference Signal Description
J16 VDDIO
Selects VDDIO bus voltage
Short pins 1-2: 3.3V IO (Default)
Short pins 2-3: 1.8V IO
Table 4-8. GPIO Interface Header - J22
Reference Signal Description
J22.1 GPIO0 General Purpose Input/Output 0
J22.3 GPIO1 General Purpose Input/Output 1
J22.5 GPIO2 General Purpose Input/Output 2
J22.7 GPIO3/INTB General Purpose Input/Output 3 / Interrupt (Active Low).
Pulled up to VDDIO by 4.7kΩ
J22.9 GPIO4 General Purpose Input/Output 4
J22.11 GPIO5 General Purpose Input/Output 5
J22.13 GPIO6 General Purpose Input/Output 6
J22.15 EN 25MHz Enable/Disable 25MHz Oscillator
Table 4-9. CMLOUT Output Signals
Reference Signal Description
TP16 CMLOUTP Test Pad for Channel Monitor Loop-through Driver
TP17 CMLOUTN Test Pad for Channel Monitor Loop-through Driver
Table 4-10. FPD-Link III Mode Control- J15
Reference Mode(1) Description
J15.1 1 CSI Mode (DS90UB953-Q1 compatible)(2)
J15.2 2 RAW12 / LF (DS90UB933 compatible)
J15.3 3 RAW12 / HF (DS90UB933 compatible)
J15.4 4 RAW10 (DS90UB933 compatible)
(1) Only set one ON.
(2) This function is only available with 2-MP ADAS chipsets.
Table 4-11. Device Mode Control - J11
Reference Signal Input = L Input = H Description
J11.1 BISTEN For Normal operation (Default) Test Mode enable Test Mode
J11.2 RSVD Tied to GND (Default) N/A Reserved
J11.3 VDD_SEL Internal 1.1V regulator from
1.8V supply (Default)
1.1V is supplied to VDD1V1
pins VDD 1.1V Source Select
J11.4 PDB Device is powered down Device is enabled (Default) Power-down Mode
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Table 4-12. LEDs
Reference LED Color LED Name Description
D3 Red VDDIO Illuminates on VDDIO Power
D4 Red VDD5V Illuminates on +5V
D5 Red VDD_EXT Illuminates if 12V Power is applied to DC-IN J24
D6 Orange VPOC_RX1 Illuminates if VPOC_RX1 is ON
D7 Orange VPOC_RX0 Illuminates if VPOC_RX0 is ON
D8 Orange PASS Illuminates if PASS pin is HIGH
D9 Green LOCK Illuminates if LOCK pin is HIGH
D10 Green GPIO6 Illuminates if GPIO6 is HIGH
D11 Green GPIO5 Illuminates if GPIO5 is HIGH
D12 Green GPIO4 Illuminates if GPIO4 is HIGH
D13 Green GPIO3/INTB Illuminates if GPIO3 is HIGH, or GPIO3 disabled (pulled-up)
D14 Green GPIO2 Illuminates if GPIO2 is HIGH
D15 Green GPIO1 Illuminates if GPIO1 is HIGH
D16 Green GPIO0 Illuminates if GPIO0 is HIGH
5 Enable and Reset
The DS90UB95x-Q1 is enabled and reset by controlling the PDB input level. PDB has an internal pull down, and
should remain low until all supplies are stable. There are three device enable and reset/power-down options for
the EVM.
• RC timing option: The RC delay created with C123 and R131 connected to the PDB pin is the default option
for delaying PDB on the EVM. This is used for simplicity of debugging and using the device. TI recommends
using a GPIO signal from a host process or to drive PDB after all rails have settled in customer designs.
• External control option: A momentary push-button switch, SW1, is available for manually driving the PDB
signal low while the button is held.
• Software control option: The PDB pin is also made available in the J24 and J26 CSI-2 output connectors,
allowing a host processor to control the PDB pin.
6 Use with DS90UB936-Q1
The DS90UB954-Q1EVM may also be used to evaluate the DS90UB936-Q1. The only modification required is
to swap the DS90UB954-Q1 with the DS90UB936-Q1.
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7 Typical Connection and Test Equipment
The following is a list of typical test equipment that may be used to monitor the MIPI CSI-2 signals from the
DS90UB95x-Q1:
1. Logic Analyzer
2. Any SCOPE with a bandwidth of at least 4 GHz for observing differential signals.
3. UNH-IOL MIPI D-PHY Reference Termination Board (RTB)
4. UNH-IOL MIPI D-PHY/CSI/DSI Probing Board
5. UNH-IOL CSIGUI Tool
8 Termination Device
A termination device is required to properly monitor and measure the transmission of the MIPI DPHY signals.
The termination device should support the change of signals as it switches between LP and HS modes. This can
be provided by either a CSI-2 receiver or a dedicated dynamic termination board. The recommended termination
board is the UNH-IOL MIPI D-PHY Reference Termination Board (RTB).
9 Typical Test Setup
Figure 9-1 illustrates a typical test set up used to measure and evaluate DS90UB95x-Q1.
Figure 9-1. Typical Test Setup for Evaluation
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10 Equipment References
Note
Please note that the following references are supplied only as a courtesy to our valued customers. It is
not intended to be an endorsement of any particular equipment or supplier.
Logic Analyzer:
Keysight Technologies
www.keysight.com
MIPI Test Fixtures:
University of New Hampshire InterOperability Laboratory (UNH-IOL)
www.iol.unh.edu/services/testing/mipi/fixtures.php
Aardvark I2C/SPI Host Adapter Part Number: TP240141
www.totalphase.com/products/aardvark_i2cspi
11 Cable References
FAKRA coaxial cable:
www.leoni-automotive-cables.com
Rosenberger FAKRA connector:
http://www.rosenberger.com/en/products/automotive/fakra.php
Equipment References www.ti.com
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12 Software for DS90UB95xQ1-EVM Evaluation - Analog LaunchPAD (ALP) Software
Setup
12.1 System Requirements
Operating System: Windows 7 64-bit
USB: USB2ANY (on-board, accessible via mini
USB connector)
USB2ANY Firmware Version: 2.5.2.0
USB: Aardvark I2C/SPI host adapter
p/n TP240141
12.2 Download Contents
Latest TI Analog LaunchPAD can be downloaded from: http://www.ti.com/tool/alp.
Download and extract the zip file to a temporary location that can be deleted later.
The following installation instructions are for a PC running Windows 7 64-bit Operating System.
12.3 Installation of the ALP Software
Execute the ALP Setup Wizard program called “ALPF_setup_v_x_x_x.exe” that was extracted to a temporary
location on the local drive of your PC.
There are 7 steps to the installation once the setup wizard is started:
1. Select the "Next" button.
2. Select “I accept the agreement” and then select the “Next” button.
3. Select the location to install the ALP software and then select the “Next” button.
4. Select the location for the start menu shortcut and then select the “Next” button.
5. There will then be a screen that allows the creation of a desktop icon. After selecting the desired choices
select the “Next” button.
6. Select the “Install” button, and the software will then be installed to the selected location.
7. Uncheck “Launch Analog LaunchPAD” and select the “Finish” button. The ALP software will start if “Launch
Analog LaunchPAD” is checked, but it will not be useful until the USB driver is installed and board is
attached.
Power the DS90UB95x-Q1 EVM board with a 12 VDC power supply.
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TEXAS
INSTRUMENTS
Analog LaunchPAD
my mm 2915
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Make sure all the software has been installed and the hardware is powered on and connected to the PC.
Execute “Analog LaunchPAD” shortcut from the start menu. The default start menu location is under All
Programs > Texas Instruments > Analog LaunchPAD vx.x.x > Analog LaunchPAD to start MainGUI.exe.
Figure 12-1. Launching ALP Splash Screen
Upon first launch of the Analog LaunchPAD utility, the default device will be DS90UB925. The active device can
be seen as highlighted in Figure 12-2, here showing the DS90UB95x as active. If the active device is already set
to DS90UB95x you may skip to Section 13.
Figure 12-2. Initial ALP Screen
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Follow the steps beginning with Figure 12-3 to change the ALP profile to DS90UB95x.
Figure 12-3. Select USB2ANY/Aardvark Setup to Change Profile
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DS90UB95x-Q1EVM Deserializer User's Guide 17
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"isfidogwwflsammmmhmofdevmmhmfifimiflehm
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Select the active profile and click "Remove". Scroll down the list of available profiles to DS90UB95x, click to
highlight it, click "Add", and click "Ok".
Figure 12-4. ALP Profiles Dialog
Software for DS90UB95xQ1-EVM Evaluation - Analog LaunchPAD (ALP) Software Setup www.ti.com
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ALP Profilfi Setup mmmusmm ‘ >75
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Figure 12-5. ALP Profiles Dialog (continued)
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ITEXAs
INSTRUMENTS
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13 Using ALP and DS90UB95x Profile
13.1 Information Tab
Under the Devices tab click on “DS90UB95x” to select the device and open up the device profile and its
associated tabs. After selecting the DS90UB95x, the following screen should appear. Figure 13-1 shows the
Information tab. The information tab shown assumes active and locked connection to a DS90UB953 on RX0,
and an open port on RX1.
Figure 13-1. ALP Information Tab
Using ALP and DS90UB95x Profile www.ti.com
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INSTRUMENTS
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13.2 Registers Tab
The Registers tab is shown in Figure 13-2. Note that the value of the currently selected register is populated in
the "Value: " box at the top. Figure 13-2 shows the register I2C_DEVICE_ID is reading a hexadecimal value of
0x60.
Figure 13-2. ALP Registers Tab
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«
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< a.="" mm="" umamzamnrm="" imihsuummy="" analog="" lamknpad="" a="" azilvunlas="" m)="" n;="" u)="" “may="" [mu-lam="" wan="" rum-m.="" rags-as="" sam="" mm="" mum="" mmhflyss="" vim-‘wy‘="" \nm‘="" \khi‘="" m.o,hm.mwvnmummmammmmt,mm="" ”ammo-raga.="" i.="" hidd-rdi—kzdmbu-d="" h—ymymuzmau—h="" dew.="" way="" mmmmmmmbmummlmnkmmwant-unmi-="" m="" m:="" lamb:="" m="" 7d="" 5g="" rm="" mm="" mwtmmflmav="" «dhdzdid="" an="" m="" i:="" may="" ”hummus“:="" ummmmm="" "value="" i="" «:11er="" i="" mfguafl‘nlfnnm="" i="" mrmmm="" i="" harms="" i="" mrnkaw‘mnm="" i="" .msrmmunmn="" i="" mrsccwamnngmd="" i="" mrlxcmtml="" i="" mrlxcmtmz="" i="" mrsumm="" i="" mama.“="" i="" mrauomm="" i="" wanna="" i="" mummy:="" i="" mm‘umngl="" alp="" rum.»="" hummummd="" fl="" 57mm="" j,="" yum!="" yum="">13.3 Registers Tab - Address 0x00 Expanded
By double clicking on the Address bar
or a single click on . Address 0x00 expanded reveals contents by bits. Any register address displayed can be
expanded.
Figure 13-3. ALP Device ID Expanded
Any RW Type register can be written into by writing the hex value into the “Value:” box, or putting
the pointer into the individual register bit(s) box by a left mouse click to put a check mark (indicating a “1”) or
unchecking to remove the check mark (indicating a “0”). Click the “Apply” button to write to the register, and
“refresh” to see the new value of the selected (highlighted) register.
The box toggles on every mouse click.
13.3.1 Port Specific Registers
13.3.2
Certain registers in the DS90UB95x-Q1 are port specific and have two copies, one for each FPD-Link RX port.
The "Select RX Port" drop-down menu controls which port's registers are read. If the "Write All RX Ports" box
is checked, both ports' registers will be written to. If it is not checked, only the port indicated by the drop-down
menu will be written to. These controls set the value of register 0x4C, which is used to set which port is being
read and which port(s) are being written to.
13.4 Saving and Loading Register Settings
Register settings can be saved and later loaded to the device using the "Save" and "Load" buttons. To save,
click on the "Save" button, select the file location, and name the file. If desired, comments may be recorded
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INSTRUMENTS
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were saved successfully. To load saved registers, click the "Load" button and select the .nrd file. Additional
information about the register settings, including any comments, will be displayed in the dialog box. After
confirming these are the desired registers settings, a message will appear confirming that the registers were
successfully loaded.
1
2
Figure 13-4. Save Register Settings Step 1
3
Figure 13-5. Save Register Settings Step 2
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flmmW “Mummm 7 H >< mm="" mo="" wan;="" raisins="" sum="" mamas="" “.ka="" rug-mm="" “mm="" i="" ea="" mm“="" m:="" el="" am="" pm»="" ma="" au="" mum="" mum!="" q="" :1="" dwmamupms="" :="" .="" mam="" m="" x;="" a="" a:="" mm="" ,-="" _a="" i="" ”i'm”="" “mm“="" *‘="" n="" ;="" v="" 5m="" \="" _="" hm;="" x="" k="" x="" \="" ii="" as="" k="" v="" i="" h="" o="" m.="" m.="" s="" w.“="" n.="" m="" m="" “wm="" k="" v="" n="" mg="" x="" z,="" n="" at}="" l="" x="" "="" ”s="" [hii="" k="" ’r="" n="" x="" n="" mrmmrm="" n="" mrumgn="" x="" ..="" mm!“="" a="" ”gammy="" x="" ..="" ”mimi“="" a="" mammal="" ,="" ..="" mummy.="" n="" flaming="" ,="" ..="" ”mug="" n="" wwwj="" ,="" alp="" wrkdw="" 1&4!)er="" mcm="" vurrmm="" q="" tm="" ‘mmmwa="" etixaflnflmmim:rr-namglaunchpl-d="" ,="" d="" x="" e="" load="" rujs‘us'aie="">< (-="" v="" 1-="" i:="" mm="" .="" dakmp="" v="" 0="" 52m="" thktap="" )2="" mam="" .="" ncwfo‘dev="" .="" el="" 0="" ”"3="" name="" date="" mama="" may="" *="" oukk="" has="" 3="" mm...="" "95...",="" wz7/2man="" on="" m,="" m="" dc="" :5“="" .j="" mm="" (="" ,="" m:="" m:="" \wflmwm="" 4="" whammmrm="" v="" i="" ma-="" i="" n="" harm:="" m="" m="" 9="" v="" alp="" flammk="" [dem="" mudd'="" hardware="" mmcannxkd="" ummm="" fl="" 1m="" [nmma="">4
Figure 13-6. Save Register Settings Step 3
1
2
Figure 13-7. Load Register Settings Step 1
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Figure 13-8. Load Register Settings Step 2
4
Figure 13-9. Load Register Settings Step 3
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INSTRUMENTS
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13.5 Scripting Tab
Figure 13-10 shows the Scripting tab. The script window provides a full Python scripting environment which can
be for running scripts and interacting with the device in an interactive or automated fashion. Commands may be
written directly into the Scripting tab or may be run from a .py file using the "Run" button. Example scripts may
be found using the "Run PreDef Script" button.
Figure 13-10. ALP Scripting Tab
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‘7 Tum m 'mmém
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< "="" )="" h.="" mm:="" ‘93,”;er="" a="" w="" sous="" (".py)="" v‘="" open="" c.“="" h="" up="" melkmm="" mode)‘="" human="" na="" comma!="" vl§7mil|="" ‘d="" mm:="" mm="" ‘7="" tm;="" my="" mum:="" m="" flu-mum“="" mock)="" »="" ham="" :4an="" .mm,="" :umh="" mu:="" "anu="" 1/1="" ouagsa="" mwmommmmmmmwm="" -="" 20:11—1an="" n="" u="" q,="" mmm="" mums="" we“;="" inszzu-ntzs="" 7="" m1“;="" hum="" innxu—nzl="" xn:.="" m="" awn"="" fill-rm="" m="" "nun.="" "banrfl’="" mum="" m="" sauce“="" film“)!="" honxd="" can“,="" he="" "mum="" .xpamms-="" mum="" .="" 1m="" uf="" up="" bean!="" fluens="" mm="" m,="" ms="" mm,="">Figure 13-11. Pre-Defined Scripts
It is also possible to create custom buttons on the Scripting tab to run a desired script. To do so, click on the
"Setup" button, then say "Add", and select the desired name and script. To make the button appear in future
instances of ALP, click the "Set As Default" button.
1
2
3
4
5
Figure 13-12. Custom Button Creation Step 1
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Figure 13-13. Custom Button Creation Step 2
WARNING
Directly interacting with devices either through register modifications or calling device support library
functions can effect the performance and/or functionality of the user interface and may even crash
the ALP Framework application.
13.5.1 Example Functions
The following are Python functions commonly used to interact with FPD-Link devices.
13.5.1.1 Local I2C Reads/Writes
These functions will perform reads and writes only for the I2C assigned to board.devAddr, which by default will
be the detected address for the DS90UB95x-Q1.
board.ReadReg(Register
Address , # of Bytes)
OR board.ReadReg(Register
Address)
I2C Read Command
• Accepts both hex & decimal inputs
• Number of bytes will default to 1 if omitted
• Ex: board.ReadReg(0x00) will return the value in Register 0 for the local
device
board.WriteReg(Register
Address , Data)
I2C Write Command
• Accepts both hex & decimal inputs
• Ex: board.WriteReg(0x01, 0x01) will set Register 0 to have a value of 1
board.devAddr = [I2C Address] Assigns I2C address to be used for board.ReadReg and board.WriteReg
commands
• Accepts both hex & decimal inputs
• Uses the 8-bit form of the I2C address
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• Can be used to shorten read/write commands
• Ex: board.devAddress = 0x60 sets the board address to 0x60
13.5.1.2 General I2C Reads/Writes:
These I2C commands will work for any I2C address on the local bus and remote devices configured in the slave
ID and slave alias registers of the device. The 8-bit form of I2C addresses should be used.
board.ReadI2C(Device Address,
Register Address , # of Bytes) OR
board.ReadI2C(Device Address,
Register Address)
I2C Read Command
• Accepts both hex & decimal inputs
• Number of bytes will default to 1 if omitted
• Ex: board.ReadI2C(0x60, 0x00) will return the value in Register 0 for
the device with address 0x60 (8-bit form)
board.WriteI2C(Device Address,
Register Address , Data)
I2C Write Command
• Accepts both hex & decimal inputs
• Ex: board.WriteI2C(0x60, 0x01, 0x01) will set Register 1 of the device
with address 0x60 (8-bit form) to have a value of 1
13.5.1.3 I2C Reads/Writes with Multi-Byte Register Addresses
These I2C commands will work for any I2C address on the local bus and remote devices configured in the slave
ID and slave alias registers of the device. The 8-bit form of I2C addresses should be used.
board.ReadI2C(Device Address,
Register Address Byte 2,[Register
Address Byte 1, # of Bytes])
OR board.ReadI2C(Device Address,
Register Address Byte 2, [Register
Address Byte 1])
I2C Read Command for devices with multi-byte register addresses
• Accepts both hex & decimal inputs
• Number of bytes will default to 1 if omitted
• Ex: board.ReadI2C(0x60, 0x30, [0x00]) will return the value in
Register 0x3000 for the device with address 0x60 (8-bit form)
board.WriteI2C(Device Address,
Register Address Byte 2, [Register
Address Byte 1, Data])
I2C Write Command for devices with multi-byte register addresses
• Accepts both hex & decimal inputs
• Number of bytes will default to 1 if omitted
• • Ex: board.WriteI2C(0x60, 0x30, [0x01, 0x01]) will set Register
0x3000 of the device with address 0x60 (8-bit form) to have a
value of 1
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I TEXAS
INSTRUMENTS
Ii thmmm Analog mxm
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13.6 GPIO Tab
Figure 13-14 shows the GPIO tab. This tab may be used to configure the DS90UB95x-Q1 GPIO pins, including
the configuration of back channel GPIOs, and FrameSync generation.
Figure 13-14. GPIO Tab
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l TEXAS
INSTRUMENTS
E has Mummy Analog lamKnPAD
o m mums aunnan/l) mum“
[mu-lam wan rum-m mum Sam mm mum mmhflyss
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Mimamlafl
mcmrmmm
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mumsenn
hummus
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mumnamm
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ALP rum.» Hummummd
n 57mm
an!“ hm
13.7 Forwarding Tab
Figure 13-15 shows the Forwarding tab. This tab may be used to configure the forwarding of CSI-2 data.
Figure 13-15. Forwarding Tab
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I TEXAS
INSTRUMENTS
[3 1m; Mummy Analog mm
lids-s
a. usva ummzomnrm
0 mums:
E—
smsam
Mum.
mmmm
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mm:
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m
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_ mmmwm Fan-mummmw mum mums
m 3 Amy 1:
Fwd AH
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I (napalm
I umrmiaz:
I umzrmirsim
I umrnmunzisltx
I umsrnmunzisltu
I umsrmmm
I nmrmmfl
I nmrmxupn
I nmrmxrm
I nmrmmuyn
I m rmjauvfi:
I m,mm,
I mmrmmzrm
I mrmjw
I an; may]?
I ma rmgmm:
I mymgmm
I murmgaum
I murmgamz
I murmicuuu
I murmicums
I mmmflmm
I mxrmgumv
I mwmxmm
I mmmflxms
n 57mm
q kn: hm“
13.8 CSI Registers Tab
Figure 13-16 shows the CSI Registers tab. This tab operates in the same way as the Registers tab, but holds the
indirect access registers used to configure pattern generation.
Figure 13-16. CSI Registers Tab
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l TEXAS
INSTRUMENTS
[3 1m; Mummy Analog lamKnPAD
lids-s o m u umasmunnmn/x) mum“
_ mmmwm wmmmmm mum mums
a. usva ummzomnrm
0 mums:
E—
smsam
Mum.
mmmm
nzmvwavaksmv
”my",
mm:
mmsgw
ALP rum.» Hummummd
m 3 Amy 1:
Fwd AH
“WW wax». u
v mum
I m rmimnczim
I mmmgl
I gunman-um
I umzrnazigi
I grammar,“
I umsrmukiml
I nmsraxmrmn
I nmraxmrml
I nmraccymmxx:
I nmrlncumull
I nmrlxjmuulz
I m 750me:
I mrmfimm
I mmaamwmun
I mmamgm
I ma rnwjm
I mynwyr
I murmjlsrram
I nxurmualsrrcm
I mwnsxmm
I murmgm
I mmrmgm
I muggy/Luna
I murmjuma‘
I mu! rm; m
I mummy}.
n 57mm
q kn: hm“
13.9 Remote Registers Tab
Figure 13-17 shows the Remote Registers tab. This tab may be used to read and write to the registers of the
partner serializer. The RX Port selection drop-down controls which serializer is communicated with, the serializer
connect to Port 0 or the serializer connected to Port 1.
Figure 13-17. Remote Registers Tab
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INSTRUMENTS
Nu Deuces Detected
1 J Mn anxhed up [mad man hnudswae dame-1. m: applcanm wm Imln muslvamn (am; emulation) made.
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m m m m,
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oi ms 1m um“
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‘ e ”gm”;
‘ puma“:
» 1 ummsmmmmum
_ 9 mvmmm
14 Troubleshooting ALP Software
14.1 ALP Does Not Detect The EVM
If the following window opens after starting the ALP software, double check the hardware setup.
Figure 14-1. ALP No Devices Error
It may also be that the USB2ANY driver is not installed. Check the device manager. There should be a
“HID-compliant device” under the “Human Interface Devices” as shown in Figure 14-2.
Figure 14-2. Windows 7, ALP USB2ANY Driver
The software should start with only “DS90UB95x” in the “Devices” pull down menu. If there are more devices
then the software is most likely in demo mode. When the ALP is operating in demo mode there is a “(Demo
Mode)” indication in the lower left of the application status bar as shown in Figure 14-3.
Troubleshooting ALP Software www.ti.com
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‘fl‘
6mm”;
0 mum
(- m Mann 1
a mums
‘: Aw Nana 2
o mummy“
n
Mmmxane
x
m mmn mm M
Figure 14-3. ALP in Demo Mode
Disable the demo mode by selecting the “Preferences” pull down menu and un-checking “Enable Demo Mode”.
Figure 14-4. ALP Preferences Menu
After demo mode is disabled, the ALP software will poll the ALP hardware. The ALP software will update and
have only “DS90UB95x” under the “Devices” pull down menu.
14.2 USB2ANY Firmware Issues
If upon plugging in the board to the PC, the user is presented with a message stating USB2ANY firmware is
out of date or is 0.0.0.0, similar to Figure 14-5, try unplugging the USB cable and plugging it in again (holding
S1 while plugging in the USB cable puts the USB2ANY into firmware update mode). If that does not solve
the problem you will have to re-flash the on-board USB2ANY firmware. To re-flash the USB2ANY, download
USB2ANY Explorer and install the application. Launch the USB2ANY Firmware Loader available at "C:\Program
Files (x86)\TI USB2ANY SDK\bin\USB2ANY Firmware Loader.exe" and follow the instructions to flash the latest
version of USB2ANY firmware. The firmware loading screen is shown in Figure 14-6.
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DS90UB95x-Q1EVM Deserializer User's Guide 35
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TEXAS
INSTRUMENTS
The conneded Figure 14-5. USB2ANY Firmware Update Notice
Figure 14-6. USB2ANY Firmware Update Procedure
Troubleshooting ALP Software www.ti.com
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Wmm
15 DS90UB95x-Q1EVM PCB Schematics, Layout and Bill of Materials - DS90UB95x-Q1EVM Schematic
Re vision History
Re v Note sApprove d b yECN # Approve d Da te
N/A N/A N/A N/A N/A
RX0
25 MHz EXT OS C
I2C
EXT CONN
P owe r
RX1
POC
CS I
GPIO
INTB
Powe r
LEDs
P DB
MODE
IDX
Stra p Re s istors / J umpe rs
GP IOn
VDD_S E L
DS 90UB954-Q1
3.3V
VDDIO
VS S
1.8V
1.1V (Op tion a l)
Copyright © 2017, Texas Instruments Incorporated
Figure 15-1. DS90UB95x-Q1EVM Block Diagram
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DS90UB95x-Q1EVM Deserializer User's Guide 37
Copyright © 2021 Texas Instruments Incorporated
X”
(.x
Mm X % IT; vT IT IT
,
IT 3:, ITL: IT IT IT IT
IT
IT X IT
MAT i? X
X IT \7 37;, 31%);
1.x 1.x 1.x 1.x
\7 s} \7 \7
X WA X (\K
J34 OPEN: I2C Address = 0x30 (7'b)
IDX
GND
0
R48
MODE
GND
GND
10k
R16 10k
R125
PDB
GND
4
1
2
3
J25
GND
0R55
0R54
I2C_SDA
I2C_SCL
0.1 µF
C51
GND
4.7 k
R524.7 k
R53
VDDIO
SW1
10µF
C123
GND
10.0 kR79
12 pFC55
12 pFC58
10.0 kR74
XOUT
XIN/REFCLK
0
R78
1
2
J23
J34 INSTALLED: I2C Address = 0x3D (7'b)
VDD1V8
VDDIO
CSI (953) - Coax
RAW12 Low-Freq (933) - Coax
RAW12 High-Freq (933) - Coax
RAW10 (933) - Coax 10 k
R25
33.2 k
R131
BISTEN
VDD_S EL
CS I_D3_ N
CS I_D3_ P
CS I_D0_ P
CS I_D0_ N
CS I_D1_ P
CS I_D1_ N
CS I_D2_ N
CS I_D2_ P
CS I_CLK0_P
CS I_CLK0_N
CS I_CLK1_P
CS I_CLK1_N
GP IO 0
GP IO 1
GP IO 2
GP IO 4
GP IO 5
GP IO 6
RIN0_P
RIN0_N
RIN1_P
RIN1_N
GND
CMLOUT_P
CMLOUT_N
RS VD
BISTEN
GP IO 3/INTB
VDDIO
4.7 k
R36
XIN/REF CLK
PDB
XOUT
VDD1V8
LOCK
PASS
GND
10k
R114
95.3 k
R117
25.5 k
R116
39.2 k
R118
78.7 k
R119
78.7 k
R120
97.6 k
R121
0
R115
DO NOT POPULATE CRYSTAL
1 2
25MHz
Y1
1
H1
DESERIALIZER EMI/EMC SHIELD
GND
100
R24
BIST EN 6
CS I_CLK0+ 12
CS I_CLK0- 1 1
CS I_CLK1+ 19
CS I_CLK1- 1 8
CS I_D0+ 14
CS I_D0- 13
CS I_D1+ 16
CS I_D1- 15
CS I_D2+ 22
CS I_D2- 21
CS I_D3+ 24
CS I_D3- 23
GP IO _0
28
GP IO _1
27
GP IO _2
26
GP IO _3/INTB
25
GP IO _4
10
GP IO _5
9
GP IO _6
8
I2C_SCL
2
I2C_SDA
1
IDX 35
LOCK 48
CMLOUT- 39
CMLOUT+ 38
MODE 37
PAD 49
PASS 47
PDB 30
RIN0+
41
RIN0-
42
RIN1+
32
RIN1-
33
TES T _EN 44
VDDIO
29 VDDIO
7
VDD1P 1_ CS I
20
VDD11_D
3
VDD11_FP D0
34
VDD11_FP D1
43
VDD18 _CS I
17
VDD_18_FP D0
40
VDD_18_FP D1
31
VDD18_P 0
45
VDD18_P 1
36
VDD_S E L
46
XIN/R EFCLK 5
XOUT 4
U5
DS90UB954TRGZRQ1
0.1 µF
C106
0.1 µF
C50
0
R75
PDB
XOUT
0.0 33µFC38
0.0 33µFC39
IDx S e lection
MODE S e lection
MODE
Config P ins
DS90UB954 Configuration
12
34
56
78
J15
Mom e n ta ry
P DB S witc h
GND
VDD1V1
GND
GND
0.0 1µF
C77
0.1 µF
C79
0.0 1µF
C60
0.1 µF
C47
0.0 1µF
C44
0.1 µF
C33
GND
VDD1V8
120 ohm
L7
1µF
C59
0.1 µF
C63
0.0 1µF
C64
0.0 1µF
C68
1µF
C73
0.1 µF
C78
1µF
C82
0.1 µF
C71
0.0 1µF
C80
10µF
C88
GND
10µF
C92
10µF
C57
120 ohm
L3
120 ohmL8
120 ohm
L5
120 ohm
L6
120 ohm
L1
GND
4.7 µF
C72
4.7 µF
C61
4.7 µF
C43
GND
0.0 1µF
C37
0.1 µF
C42
120 ohm
L2
4.7 µF
C36
22µF
C35
22µF
C32
0R88
0R37
0R27
0R28
VDD1V8VDD3V3
1
2
3
J16
GND
VDDIO
120 ohm
L4
1µF
C46
0.1 µF
C66
0.0 1µF
C45
0.0 1µF
C65
VDDIO S elect
3.3V or 1.8V
VDD1V1_FP D1
VDD1V1_FP D0
VDD1V1_D
VDD1V8_P
VDD1V8_ CS I
VDD1V8_ FP D
VDD1V1_ CS I
IDX
Default is 1.8V. On-boa rd level shifte r (pa ge 7) to conve rt loca l
3.3 V logic from on -boa rd US B2ANY to 1.8V logic
12
34
56
78
J11
VDD_S EL
VDD_S E L: This pa ge ; Co nfig P ins
bottom right
Pa ge 5 Power; 1.1V LDO EN pin
VDDIO
VDD_S EL
XIN/REF CLK
RS VD
RC De lay on
P DB P in
10.0 k
R49
GND
0.1 µF
C75
0.0 1µF
C74
GND
VDD1V8
10k
R87
GND
0R85
50
R31
EN_25MHz
Se e p a ge 6
REF CLOCK
1
2
3
4
5
J21
GND
XIN/REF CLK
VDD
4
S TANDBY
1GND 2
OUT 3
25 MHz
Y2
TP16
TP17
22µF
C29
22µF
C34
22µF
C40
22µF
C41
22µF
C81
22µF
C48
22µF
C49
22µF
C53
22µF
C54
22µF
C62
22µF
C67
22µF
C86
22µF
C87
22µF
C93
Copyright © 2017, Texas Instruments Incorporated
Figure 15-2. DS90UB95x-Q1EVM Main Circuit - Page 1
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INSTRUMENTS
|:|
m mm ‘
EXT_S C L
EXT_S DA
EXT_REF_CLK
GND
0R30EXT_S C L
0R29EXT_S DA
I2C_SCL
I2C_SDA
0
R50
0
R51
EXT_VDD_3V3
EXT_VDD_1V8
0
R86
EXT_REF_CLK XIN/REFCLK
RE S ET
EXT_GP IO0
EXT_GP IO1
EXT_GP IO2
0R130EXT_GP IO0 G P IO0
0R82EXT_GP IO1
0R35EXT_GP IO2
GP IO 1
GP IO 2
EXT_S C L
EXT_S DA
EXT_REF_CLK
GND
0
R57
0
R56
EXT_VDD_3V3
EXT_VDD_1V8
RE S ET
EXT_GP IO0
EXT_GP IO1
EXT_GP IO2
0 0201R71
0 0201R72
0 0201R60
0 0201R61
0 0201R62
0 0201R63
0 0201R64
0 0201R65
0 0201R66
0 0201R67
0 0201R68
0 0201R69
GND
1
3
2
4
5
7
6
8
9
11
10
12
13
15
14
16
17
19
18
20
21
23
22
24
25
27
26
28
29
31
30
32
33
35
34
36
37
39
38
40
MP1 MP2
MP3 MP4
J24
GND
0R32RE S ET PDB
CSI-2 CONNECTION
CSI-2 CONNECTION
CS I_D3_ N
CS I_D3_ P
CS I_D0_ P
CS I_D0_ N
CS I_D1_ P
CS I_D1_ N
CS I_D2_ N
CS I_D2_ P
CS I_CLK0_P
CS I_CLK0_N
CS I_CLK1_P
CS I_CLK1_N
1
3
2
4
5
7
6
8
9
11
10
12
13
15
14
16
17
19
18
20
21
23
22
24
25
27
26
28
29
31
30
32
33
35
34
36
37
39
38
40
MP1 MP2
MP3 MP4
J26
BOT_CLK0_P
BOT_CLK0_N
BOT_D0_ P
BOT_D0_ N
BOT_D1_ P
BOT_D1_ N
BOT_D2_ P
BOT_D2_ N
BOT_D3_ P
BOT_D3_ N
BOT_CLK1_P
BOT_CLK1_N
0R34
0R33
0R46
0R47
0R44
0R45
0R40
0R41
0R38
0R39
0R42
0R43
Place re sistors clos e to device
TOP _CLK0_P
TOP _CLK0_N
TOP _D0_P
TOP _D0_N
TOP _D1_P
TOP _D1_N
TOP _D2_P
TOP _D2_N
TOP _D3_P
TOP _D3_N
TOP _CLK1_P
TOP _CLK1_N
MIPI CSI-2 Output Connectors
Top Side Connector
Bottom Side Connector
Copyright © 2017, Texas Instruments Incorporated
Figure 15-3. DS90UB95x-Q1EVM CSI-2 Connectors - Page 2
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DS90UB95x-Q1EVM Deserializer User's Guide 39
Copyright © 2021 Texas Instruments Incorporated
w TEXAS
INSTRUMENTS
Power over Coax (POC)
GND
49.9
R96
GND
1
2 3
4
L12
VPOC_RX0
GND
0.1 µF
C90
0.1 µF
C85
GND
RIN0_P
RIN0_N
VPOC_RX1
GND
0.1 µF
C96
0.1 µF
C98
GND
RIN1_P
RIN1_N
0.0 47µF
C76
0.1 µF
C70
1000 ohm
L13
1000 ohm
L20
10µF
C89
10µF
C91
10µF
C97
10µF
C95
100µH
L18
10µH
L19
4.0 2 k
R83
1500 ohm
L15
1500 ohm
L16
0.0 33µF
C83
0.0 15µF
C84
VPOC_RX0
VPOC_RX1
VPOC_LDO0_9V
Configure d for ope ra tion with a
DS90UB953-Q1.
Configure d for ope ra tion with a
DS90UB933-Q1.
0
R84
4.0 2 k
R100
4.0 2 k
R108 VPOC_LDO1_9V
RX0 can be powe re d by 9VLDO0 by ins talling jumpe r or
an alaternate source by ope ning jumper a nd a ttaching a
source to pin 1
1
2
J18
1
2
J17
RX1 can be powe re d by 9VLDO1 by ins talling jumpe r or
an alaternate source by ope ning jumper a nd a ttaching a
source to pin 1
GND
10µH
L11
100µH
L10
330 ohm
L14
47 ohm
L17
0
R95
49.9
R90
TP12
1
2
3
4
5
J30
RX0n
1
2
3
4
5
J31
RX1
1
2
3
4
5
J29
RX0p
Copyright © 2017, Texas Instruments Incorporated
Figure 15-4. DS90UB95x-Q1EVM PoC Circuits - Page 3
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‘ ,wa
Q Q
1
3
2
J1 40V
D17
22µF
C127
2.2 µF
C129 0.1µF
C128
GND
100k
1
R133
0
R11
0.1 µF
C17
4.7 µF
C15
10µF
C16
0.1 µF
C18
GND
10µF
C20
0.1 µF
C22
GND
100k
R15
33 00pF
C24
10.0 k
R132
10pF
C23
47µF
C107
10µF
C110
0.1 µF
C113
GND
100µF
C108
GND
0
R129
0
R126
1
2
J13
0.1 µF
C122
12 4k
R14
22.1 k
R93
3.2 4 k
R13
GND
1GND 3
1EN
4
1IN
5
1IN
6
2GND 9
2EN
10
2IN
11
2IN
12 2OUT 17
2OUT 18
2R ES E T 22
1OUT 23
1OUT 24
1R ES E T 28
EP 29
U10A
TPS767D318PWP
GND
0
R12
0.1 µF
C21
4.7 µF
C19
10 0k
1R124
GND
0.1 µF
C121
0.1 µF
C125
GND
5V_SW
VDD_EXT
VDD3V3
VDD1V8
VDD5V
1
2
3
J6
1
2
3
J12
EXT_VDD_3V3
EXT_VDD_1V8
1 2
34
T1
1
2
J3
5-146261-1
F1
4.7 µH
L21
VO 1
VFB 2
VREG5 3
SS 4
GND 5
P G 6
EN 7
P GND1
8
P GND2
9
S W1
10
S W2
11
VBST
12
VIN
13
VCC
14
PAD
15
U4
TP S 542 25 P WP R
1µF
C26
1µF
C124
1µF
C25
10µF
C27
GND
GND
0.1 µF
C117
GND
4.7 µF
C105
4.9 9 k
R128
1.8 7 k
R127
10µF
C114
1
2
J14
0
R122
1
2
J28
5-146261-1
VDD5V
0.0 1µF
C115
0.1 µF
C116
1µF
C118
4.7 µF
C109
10 0k
R123
1
2
3
J9
TSW-10 3-07-G-S
EXT_VDD_3V3
VDD1V1
IN
1
IN
2P G 3
BIAS
4
EN
5
GND 6
SS
7
FB 8
OUT 9
OUT 10
EP 11
U9
TPS 74801 TDRCRQ1
1µF
C120
1µF
C119
GND
12V
External Supply
5V @ 2A
Switching Regulator
22µF
C94
GND
10.0 k
R20
3.2 4 k
R19
GND
VDD_EXT
5V_LDO
10.0 k
R107
29.4 k
R18
0
R17
0
R106
GND
IN
3OUT 5
GND 7
ADJ 8
ON/O F F
1
DAP
9
NC
4
NC
6
GND 2
U7 LM2941LD/NOP B
1µF
C28
1µF
C104
1µF
C103
GND
1
2
3
J10
5V_LDO
VDD5V
5V_SW
5V @ 1A
Linear Regulator
Select 5V Supply
for VDD5V
GND
3.3V @ 1A Linear Regulator
1.8V @ 1A Linear Regulator
1.1V @ 1.5A Linear Regulator
NC
1
NC
2
NC
7
NC
8
NC
13
NC
14
NC
15
NC 16
NC 19
NC 20
NC 21
NC 25
NC 26
NC 27
U10B
TPS 767D318P WP
VDD5V
Power Distribution
0
R113
VDD_S EL
LM2941 ON/OFF pin is active low, s o isnta ll jumpe r to tie the
ON/O F F pin to ground a nd ena ble the de vice .
22µF
C69
GND
10.0 k
R102
3.2 4 k
R21
GND
VDD_EXT
VPOC_LDO0_9V
0
R26
5.6 k
R99
0
R22
GND
IN
3OUT 5
GND 7
ADJ 8
ON/O F F
1
DAP
9
NC
4
NC
6
GND 2
U6 LM2941LD/NOP B
1µF
C31
1µF
C30
1µF
C100
9V @ 1A Linear Regulator for PoC RX0
34.0 k
R23
22µF
C99
GND
10.0 k
R111
3.2 4 k
R112
GND
VDD_EXT
VPOC_LDO1_9V
0
R103
5.6 k
R110
0
R109
IN
3OUT 5
GND 7
ADJ 8
ON/O F F
1
DAP
9
NC
4
NC
6
GND 2
U8 LM2941LD/NOP B
1µF
C101
1µF
C102
1µF
C112
GND
34.0 k
R105
9V @ 1A Linear Regulator for PoC RX1
1 2
3 4
5 6
7 8
J8
VDD_EXT
GND
12
34
56
78
J27
GND
VPOC_LDO1_EN
VPOC_LDO1_EN
VPOC_LDO0_EN
VPOC_LDO0_EN
TP1
TP3 TP 4
TP9
TP10
TP5 TP 6
TP7
TP8
TP11
TP13
TP14
TP15
Copyright © 2017, Texas Instruments Incorporated
Figure 15-5. DS90UB95x-Q1EVM Power Distribution Circuits - Page 4
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I TEXAS
INSTRUMENTS
|:|
s , § 5
Gre e n
2 1
D16
220
R58
Gre e n
2 1
D15
220
R59
Gre e n
2 1
D14
220
R70
Gre e n
2 1
D12
220
R77
Gre e n
2 1
D11
220
R80
Gre e n
2 1
D10
220
R81
GP IO 0
GP IO 1
GP IO 2
GP IO 4
GP IO 5
GP IO 6
LOCK
PASS
220
R89
Gre e n
2 1
D8
220
R91
Ora nge
D9
GND
470
R73
GND
10 0k
R76
VDD3V3
Gre e n
21
D13
GP IO 3/INTB
1
2 3
Q1
GND
GP IO 0
GP IO 1
GP IO 2
GP IO 3/INTB
GP IO 4
GP IO 5
GP IO 6
LED Indicators and GPIO Header
VDD_EXT
GND
VPOC_RX0
GND
VDD5V
220
R101
GND
Supe r Re d
21
D5
Supe r Re d
21
D4
2.4 k
R97
2.4 k
R98
Ora nge
D6
VDDIO
220
R104
GND
Supe r Re d
21
D3
Input P owe r LEDs
GP IO LEDs
GP IO He a de r
EN_25MHz
GP IO3/INTB LED
VPOC_RX1
GND
Ora nge
D7
Power ove r Coax LEDs
470
R94
470
R92
LOCK / PASS LEDs
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
J22
LOCK
PASS
Copyright © 2017, Texas Instruments Incorporated
Figure 15-6. DS90UB95x-Q1EVM LED Circuits - Page 5
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P6. 4/CB4/A4 1
P6. 5/CB5/A5 2
P6. 6/CB6/A6 3
P6. 7/CB7/A7 4
P7. 0/CB8/A12
5
P7. 1/CB9/A13
6
P7. 2/CB10/A14
7
P7. 3/CB11/A15
8
P5. 0/A8/VREF +/VEREF+
9
P5. 1/A9/VREF -/VEREF-
10
AVCC1
11
P5. 4/XIN
12
P5. 5/XOUT
13
AVS S1 14
P8. 0 15
P8. 1 16
P8. 2 17
DVCC1
18 DVSS 1 19
VCORE
20
P1. 0/TA0CLK/ACLK
21
P1. 1/TA0.0
22
P1. 2/TA0.1
23
P1. 3/TA0.2
24
P1. 4/TA0.3
25
P1. 5/TA0.4
26
P1. 6/TA1CLK/CBOUT
27
P1. 7/TA1.0
28
P2. 0/TA1.1 29
P2. 1/TA1.2 30
P2. 2/TA2CLK/SMCLK 31
P2. 3/TA2.0 32
P2. 4/TA2.1 33
P2. 5/TA2.2 34
P2. 6/RTCCLK/DMAE0 35
P 2.7 /UCB0 S TE/UCA0C LK 36
P 3.0 /UCB0 S IMO/UCB0 SDA
37
P 3.1 /UCB0 S OMI/UCB0S CL
38
P 3.2 /UCB0 CLK/UC A0S TE
39
P 3.3 /UCA0TXD/UCA0S IMO
40
P 3.4 /UCA0RXD/UCA0S O MI
41
P3. 5/TB0.5
42
P3. 6/TB0.6
43
P 3. 7/TB0O UTH/S VMOUT
44
P 4.0 /P M_UCB1S TE /P M_UCA1CLK 45
P 4.1 /P M_UCB1S IMO/P M_UCB1 SDA 46
P 4.2 /P M_UCB1S O MI/P M_UCB1S C L 47
P 4.3 /P M_UCB1C LK/PM_UCA1S TE 48
DVSS 2 49
DVCC2
50
P 4.4 /P M_UCA1TXD/PM_UC A1S IMO 51
P 4.5 /P M_UCA1RXD/P M_UCA1S OMI 52
P4. 6/P M_NONE 53
P4. 7/P M_NONE 54
P5. 6/TB0.0
55
P5. 7/TB0.1
56
P7. 4/TB0.2
57
P7. 5/TB0.3
58
P7. 6/TB0.4
59
P7. 7/TB0CLK/MCLK
60
VSS U 61
PU.0/DP 62
PUR 63
PU.1/DM 64
VBUS
65
VUSB
66
V18
67
AVS S2 68
P5. 2/XT2IN
69
P5. 3/XT2OUT
70
TES T /S BWTCK 71
P J .0/ TDO 72
P J .1/ TDI/TCLK 73
P J .2/ TMS 74
P J .3/ TCK 75
RS T/NMI/S BWTDIO 76
P6. 0/CB0/A0 77
P6. 1/CB1/A1 78
P6. 2/CB2/A2 79
P6. 3/CB3/A3 80
U11
MSP430F5529IPN
1 2
24MHz
Y3
U2A_3V3
U2A_3V3
GND
GND
DP
PUR
DM
VBUS
VUSB
V18
U2A_I2C_S CL
U2A_I2C_S DA
GP IO 6/P WM1/S P I(CS )
U2A_3V3
GP IO 2/S P I(S CLK)
GP IO 5/S P I(S OMI)/UAR T(RXD)
GP IO 4/S P I(S IMO )/UART(TXD)
GND
33k
R10
GND
GND
GND
GND
1 2
3 4
J7
GP IO 7/P WM0 GP IO 3/P WM2
EF C0 /GP IO1 2/C LOC K
GP IO 11/VER EF +
GP IO 10/VER EF -
GP IO 8/ADC3
GP IO 9/ADC2
1
2 3
Q2
0.1 µF
C13
30 pF
C10
30 pF
C9
0.4 7µF
C126
2200pF
C11
0.1 µF
C14
0.1 µF
C111
200
R1
0
R7
0
R6
0
R5
BSL
2
3
4
1
5
J2
41
32
S1
VBUS
DM
DP
PUR
VUSB
V18
33
R134
33
R135
GND
GND
1.5 k
R2
33k
R3
GND
GND
GND
USB P O RT
GND
0.1 µF
C3
220pF
C1
220pF
C8
1.2M
R4
IO1
1
IO2
2
GND
3IO3 4
IO4 5
VCC 6
U1
OUT 1
NC
2
NR 3
GND 4
EN
5
NC
6
NC
7
IN
8
PAD 9
U2
TPS 73533 DRBR
7.5 V
D2
60 ohm
FB1
GNDGND
GND GND
VBUS
GND
22µF
C7
GND
U2A_3V3
2.2 µF
C6
0.0 1µF
C2
1µF
C5
On-Board USB2ANY
LEVEL S HIFTER
SDA_B 1
GND 2
VCCA
3
SDA_A
4SCL_A
5
OE
6
VCCB
7
SCL_B 8
U3
TCA9406DCUR
GND
0.1 µF
C12
0.1 µF
C4
U2A_I2C_S DA
U2A_I2C_S CL
I2C_SDA
I2C_SCL
GND
0
R8
10.0 k
R9
U2A_3V3
USB-TO-3.3V REGULATOR
NOTE: NO P OWER DISTRIBUTION S WITCH NEEDED FOR EXT 3.3V SUP P LY
VDDIO
Gre e n
21
D1
TP2
Copyright © 2017, Texas Instruments Incorporated
Figure 15-7. DS90UB95x-Q1EVM USB2ANY Circuits - Page 6
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DS90UB95x-Q1EVM Deserializer User's Guide 43
Copyright © 2021 Texas Instruments Incorporated
I TEXAS
INSTRUMENTS
TNT ”
gflggfia
EEEEEE
_
Cé
LOGO
PCB
Texas Instrume nts
HSDC007
A
PCB Numbe r:
PCB Re v:
Ass e mb ly Note
ZZ3
The s e a s se mblie s a re ES D s e nsitive , ESD pre ca utions s ha ll be obs e rve d .
Ass e mb ly Note
ZZ2
The s e a s se mblie s must be clea n a nd free from flux a nd a ll contamina nts . Use of no cle a n flux is not a ccepta b le .
Ass e mb ly Note
ZZ4
The s e a s se mblie s must comply with workma ns hip sta nda rd s IPC-A-610 Clas s 2, unles s othe rwise spe cifie d .
LOGO
PCB
Pb-Fre e S ymbo l
GND GND
4700pF
C56
4700pF
C131
4700pF
C52
4700pF
C130
GND
LOGO
PCB
FCC disclaime r
Va riant/Labe l Ta ble
Varia n t Labe l Text
001 DS 90UB954-Q1EVM
GND
Guiding holes for CS I conne ctor
FID2FID1 FID3
FID5FID4 FID6
1
H5
NY P MS 440 0025 P H
1
H1
NY P MS 440 0025 P H
1
H6
NY P MS 440 0025 P H
1
H2
NY P MS 440 0025 P H
MH3 MH4
SH-J 1 S H-J2
SH-J 3
SH-J 7 S H-J8 S H-J 9
SH-J 4
SH-J 10
SH-J 5
SH-J 11
SH-J 6
SH-J 12
Copyright © 2017, Texas Instruments Incorporated
Figure 15-8. DS90UB95x-Q1EVM Miscellaneous Hardware
DS90UB95x-Q1EVM PCB Schematics, Layout and Bill of Materials - DS90UB95x-Q1EVM Schematic www.ti.com
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INSTRUMENTS
TEXAS
DSSOUBSSJVOT
7
O
U
C
D
S
H
16 DS90UB95x-Q1 EVM PCB Layout
Figure 16-1. Top View Composite
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Copyright © 2021 Texas Instruments Incorporated
TEXAS
INSTRUMENTS
Figure 16-2. Layer 1: Top Signal Layer
DS90UB95x-Q1EVM PCB Schematics, Layout and Bill of Materials - DS90UB95x-Q1EVM Schematic www.ti.com
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INSTRUMENTS
.
o
o
.
o
o
a
o
Figure 16-3. Layer 2: GND Plane 1
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DS90UB95x-Q1EVM Deserializer User's Guide 47
Copyright © 2021 Texas Instruments Incorporated
INSTRUMENTS
.
o
o
.
o
o
a
o
Figure 16-5. Layer 4: GND Plane 2
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Copyright © 2021 Texas Instruments Incorporated
S
T
N
E
m
m
S
m
Figure 16-6. Layer 5: GND Plane 3
DS90UB95x-Q1EVM PCB Schematics, Layout and Bill of Materials - DS90UB95x-Q1EVM Schematic www.ti.com
50 DS90UB95x-Q1EVM Deserializer User's Guide SNLU223B – AUGUST 2017 – REVISED APRIL 2021
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INSTRUMENTS
Figure 16-8. Layer 7: GND Plane 4
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w: - «@qu
. ED P j. 0 I1]
Figure 16-9. Layer 8: Bottom Signal Layer
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TEXAS
INSTRUMENTS
Figure 16-10. Bottom View Composite
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TEXAS
INSTRUMENTS
17 DS90UB95xQ1-EVM Bill of Materials
Table 17-1. DS90UB95x-Q1EVM BOM
ITEM QTY DESIGNATOR VALUE PART NUMBER MANUFACT
URER
DESCRIPTION
1 1 !PCB1 HSDC007 Any Printed Circuit Board
2 2 C1, C8 220pF 06035A221FAT2A AVX CAP, CERM, 220 pF, 50 V, +/- 1%, C0G/
NP0, 0603
3 1 C2 0.01uF C1608X7R1H103K080AA TDK CAP, CERM, 0.01 µF, 50 V, +/- 10%, X7R,
0603
4 5 C3, C13, C14,
C75, C111
0.1uF 0603YC104JAT2A AVX CAP, CERM, 0.1 µF, 16 V, +/- 5%, X7R,
0603
5 2 C4, C12 0.1uF GRM155R71C104KA88D MuRata CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R,
0402
6 1 C5 1uF C0805C105K3RACTU Kemet CAP, CERM, 1 µF, 25 V, +/- 10%, X7R,
0805
7 1 C6 2.2uF 0805YD225KAT2A AVX CAP, CERM, 2.2 µF, 16 V, +/- 10%, X5R,
0805
8 1 C7 22uF EEE-1AA220WR Panasonic -
ECG
CAP ALUM 22UF 10V 20% SMD
9 2 C9, C10 30pF GRM1885C2A300JA01D MuRata CAP, CERM, 30 pF, 100 V, +/- 5%, C0G/
NP0, 0603
10 1 C11 2200pF C0603X222K5RACTU Kemet CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R,
0603
11 4 C15, C19, C105,
C109
4.7uF GRM21BR71C475KA73L MuRata CAP, CERM, 4.7uF, 16V, +/-10%, X7R,
0805
12 5 C16, C20, C110,
C114, C123
10uF GRM21BR71A106KE51L MuRata CAP, CERM, 10uF, 10V, +/-10%, X7R,
0805
13 12 C17, C18, C21,
C22, C51, C113,
C116, C117, C121,
C122, C125, C128
0.1uF GRM155R71C104KA88D MuRata CAP, CERM, 0.1uF, 16V, +/-10%, X7R,
0402
14 1 C23 10pF GRM1555C1H100JA01D MuRata CAP, CERM, 10pF, 50V, +/-5%, C0G/NP0,
0402
15 1 C24 3300pF GRM155R71H332KA01D MuRata CAP, CERM, 3300pF, 50V, +/-10%, X7R,
0402
16 2 C25, C124 1uF GCM188R71C105KA64D MuRata CAP, CERM, 1 µF, 16 V, +/- 10%, X7R,
AEC-Q200 Grade 1, 0603
17 9 C26, C28, C30,
C31, C101, C102,
C104, C119, C120
1uF GRM185R61C105KE44D MuRata CAP, CERM, 1 µF, 16 V, +/- 10%, X5R,
0603
18 1 C27 10uF GRM188R61E106MA73D MuRata CAP, CERM, 10 µF, 25 V, +/- 20%, X5R,
0603
19 14 C29, C34, C40,
C41, C48, C49,
C53, C54, C62,
C67, C81, C86,
C87, C93
22uF GRT31CR61E226KE01L MuRata CAP, CERM, 22 µF, 25 V,+/- 10%, X5R,
AEC-Q200 Grade 3, 1206
20 2 C32, C35 22uF GRT31CR61E226KE01L MuRata CAP, CERM, 22 µF, 25 V, +/- 10%, X5R,
AEC-Q200 Grade 3, 1206
21 8 C33, C42, C47,
C63, C66, C71,
C78, C79
0.1uF CGA2B3X7R1H104K050BB TDK CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R,
AEC-Q200 Grade 1, 0402
22 4 C36, C43, C61,
C72
4.7uF C0805C475K3PACTU Kemet CAP, CERM, 4.7 µF, 25 V, +/- 10%, X5R,
0805
23 9 C37, C44, C45,
C60, C64, C65,
C68, C77, C80
0.01uF GCM155R71H103KA55D MuRata CAP, CERM, 0.01uF, 50V, +/-10%, C0G/
NP0, 0402
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TEXAS
INSTRUMENTS
Table 17-1. DS90UB95x-Q1EVM BOM (continued)
ITEM QTY DESIGNATOR VALUE PART NUMBER MANUFACT
URER
DESCRIPTION
24 3 C38, C39, C83 0.033uF CGA2B3X7R1H333K050BB TDK CAP, CERM, 0.033 µF, 50 V, +/- 10%,
X7R, AEC-Q200 Grade 1, 0402
25 8 C46, C59, C73,
C82, C100, C103,
C112, C118
1uF C1005JB1V105K050BC TDK CAP, CERM, 1 µF, 35 V, +/- 10%, JB, 0402
26 2 C50, C106 0.1uF C1005X5R1H104K050BB TDK CAP, CERM, 0.1 µF, 50 V, +/- 10%, X5R,
0402
27 4 C52, C56, C130,
C131
4700pF 08051C472KAT2A AVX CAP, CERM, 4700 pF, 100 V, +/- 10%,
X7R, 0805
28 2 C55, C58 12pF GRM1555C1E120JA01D MuRata CAP, CERM, 12pF, 25V, +/-5%, C0G/NP0,
0402
29 3 C57, C88, C92 10uF CL21A106KAFN3NE Samsung CAP, CERM, 10 µF, 25 V, +/- 10%, X5R,
0805
30 4 C69, C94, C99,
C127
22uF 293D226X0025D2TE3 Vishay-
Sprague
CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm,
SMD
31 5 C70, C85, C90,
C96, C98
0.1uF C1005X7R1H104K050BB TDK CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R,
0402
32 1 C74 0.01uF 06031C103KAT2A AVX CAP, CERM, 0.01 µF, 100 V, +/- 10%,
X7R, 0603
33 1 C76 0.047uF C1005X7R1H473K050BB TDK CAP, CERM, 0.047 µF, 50 V, +/- 10%,
X7R, 0402
34 1 C84 0.015uF CGA2B3X7R1H153K050BB TDK CAP, CERM, 0.015 µF, 50 V, +/- 10%,
X7R, AEC-Q200 Grade 1, 0402
35 4 C89, C91, C95,
C97
10uF C1608X5R1E106M080AC TDK CAP, CERM, 10 µF, 25 V, +/- 20%, X5R,
0603
36 1 C107 47uF GRM32ER61C476ME15L MuRata CAP, CERM, 47uF, 16V, +/-20%, X5R,
1210
37 1 C108 100uF T495D107M016ATE100 Kemet CAP, TA, 100uF, 16V, +/-20%, 0.1 ohm,
SMD
38 1 C115 0.01uF 06031C103JAT2A AVX CAP, CERM, 0.01uF, 100V, +/-5%, X7R,
0603
39 1 C126 0.47uF GRM188R71A474KA61D MuRata CAP, CERM, 0.47 µF, 10 V, +/- 10%, X7R,
0603
40 1 C129 2.2uF 293D225X9025A2TE3 Vishay-
Sprague
CAP, TA, 2.2uF, 25V, +/-10%, 6.3 ohm,
SMD
41 9 D1, D8, D10, D11,
D12, D13, D14,
D15, D16
Green 150060VS75000 Wurth
Elektronik
eiSos
LED, Green, SMD
42 1 D2 7.5V 1SMB5922BT3G ON
Semiconduct
or
Diode, Zener, 7.5 V, 550 mW, SMB
43 3 D3, D4, D5 Super
Red
150060SS75000 Wurth
Elektronik
eiSos
LED, Super Red, SMD
44 3 D6, D7, D9 Orange LTST-C190KFKT Lite-On LED, Orange, SMD
45 1 D17 40V 1N5819HW-7-F Diodes Inc. Diode, Schottky, 40V, 1A, SOD-123
46 1 F1 0440002.WR Littelfuse Fuse, 2 A, 32 V, SMD
47 1 FB1 60 ohm BK1608HS600-T Taiyo Yuden Ferrite Bead, 60 ohm @ 100 MHz, 0.8 A,
0603
48 6 FID1, FID2, FID3,
FID4, FID5, FID6
N/A N/A Fiducial mark. There is nothing to buy or
mount.
49 1 H1 BMI-S-201-F Laird EMI SHIELD, 13.66 x 12.70 mm, SMT
50 4 H1, H2, H5, H6 NY PMS 440 0025 PH BF Fastener
Supply
Machine Screw, Round, 4-40 x 1/4, Nylon,
Philips panhead
51 1 J1 PJ-102A CUI Inc. Connector, DC Jack 2.1X5.5 mm, TH
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Table 17-1. DS90UB95x-Q1EVM BOM (continued)
ITEM QTY DESIGNATOR VALUE PART NUMBER MANUFACT
URER
DESCRIPTION
52 1 J2 1734035-2 TE
Connectivity
Connector, Receptacle, Mini-USB Type B,
R/A, Top Mount SMT
53 7 J3, J13, J14, J17,
J18, J23, J28
5-146261-1 TE
Connectivity
Header, 100mil, 2x1, Gold plated, TH
54 5 J6, J9, J10, J12,
J16
TSW-103-07-G-S Samtec, Inc. Header, TH, 100mil, 3x1, Gold plated, 230
mil above insulator
55 1 J7 TSW-102-07-G-D Samtec Header, 100mil, 2x2, Gold, TH
56 4 J8, J11, J15, J27 TSW-104-07-G-D Samtec Header, 100mil, 4x2, Gold, TH
57 1 J21 MMCX-J-P-H-ST-TH1 Samtec Connector, MMCX 50 ohm, TH
58 1 J22 TSW-110-07-G-D Samtec Header, 100mil, 10x2, Gold, TH
59 1 J24 QSH-020-01-H-D-DP-A Samtec Receptacle, Differential, 0.5mm, 10 pair
x2, Gold, SMT
60 1 J25 0022112042 Molex Header, 100mil, 4x1, White, TH
61 1 J26 QTH-020-04-L-D-DP-A Samtec Header(shrouded), 0.5mm, 10 pair x 2,
Gold, SMT
62 3 J29, J30, J31 59S20X-40ML5-Z Rosenberger Connector, RF, 50 Ohm, R/A, TH
63 8 L1, L2, L3, L4, L5,
L6, L7, L8
120 ohm BLM18SG121TN1D MuRata Ferrite Bead, 120 ohm @ 100 MHz, 3 A,
0603
64 2 L10, L18 100uH CLF6045NIT-101M-D TDK Inductor, Wirewound, Ferrite, 100 µH, 0.61
A, 0.32 ohm, AEC-Q200 Grade 0, SMD
65 1 L11 10uH LQH3NPN100NG0 MuRata Inductor, Wirewound, Ferrite, 10 µH, 0.5 A,
0.57 ohm, SMD
66 1 L12 DLW21SN900HQ2L MuRata Coupled inductor, 0.28 A, 0.41 ohm, +/-
25%, SMD
67 2 L13, L20 1000
ohm
BLM18AG102SN1D MuRata Ferrite Bead, 1000 ohm @ 100 MHz, 0.4
A, 0603
68 1 L14 330 ohm MPZ1005S331ETD25 TDK Ferrite Bead, 330 ohm @ 100 MHz, 0.7 A,
0402
69 2 L15, L16 1500
ohm
BLM18HE152SN1D MuRata Ferrite Bead, 1500 ohm @ 100 MHz, 0.5
A, 0603
70 1 L17 47 ohm MPZ1005F470ETD25 TDK Ferrite Bead, 47 ohm @ 100 MHz, 0.45 A,
0402
71 1 L19 10uH LQH3NPN100MJRL MuRata Inductor, Wirewound, Ferrite, 10 µH, 0.81
A, 0.24 ohm, SMD
72 1 L21 4.7uH 7440650047 Wurth
Elektronik
Inductor, Shielded Drum Core, Ferrite, 4.7
µH, 4.2 A, 0.02 ohm, SMD
73 2 Q1, Q2 50V BSS138 Fairchild
Semiconduct
or
MOSFET, N-CH, 50 V, 0.22 A, SOT-23
74 1 R1 200 CRCW0603200RFKEA Vishay-Dale RES, 200, 1%, 0.1 W, 0603
75 1 R2 1.5k CRCW04021K50JNED Vishay-Dale RES, 1.5k ohm, 5%, 0.063W, 0402
76 2 R3, R10 33k CRCW040233K0JNED Vishay-Dale RES, 33k ohm, 5%, 0.063W, 0402
77 1 R4 1.2Meg CRCW06031M20JNEA Vishay-Dale RES, 1.2 M, 5%, 0.1 W, 0603
78 12 R5, R6, R29, R30,
R32, R35, R48,
R75, R82, R85,
R86, R130
0 ERJ-2GE0R00X Panasonic RES, 0, 5%, 0.063 W, 0402
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Table 17-1. DS90UB95x-Q1EVM BOM (continued)
ITEM QTY DESIGNATOR VALUE PART NUMBER MANUFACT
URER
DESCRIPTION
79 25 R7, R33, R34,
R38, R39, R40,
R41, R42, R43,
R44, R45, R46,
R47, R60, R61,
R62, R63, R64,
R65, R66, R67,
R68, R69, R71,
R72
0 ERJ-1GE0R00C Panasonic RES, 0, 5%, 0.05 W, 0201
80 7 R8, R11, R12,
R54, R55, R78,
R115
0 ERJ-2GE0R00X Panasonic RES, 0 ohm, 5%, 0.063W, 0402
81 1 R9 10.0k CRCW040210K0FKED Vishay-Dale RES, 10.0 k, 1%, 0.063 W, 0402
82 4 R13, R19, R21,
R112
3.24k CRCW04023K24FKED Vishay-Dale RES, 3.24k ohm, 1%, 0.063W, 0402
83 1 R14 124k CRCW0402124KFKED Vishay-Dale RES, 124k ohm, 1%, 0.063W, 0402
84 5 R15, R76, R123,
R124, R133
100k CRCW0402100KJNED Vishay-Dale RES, 100k ohm, 5%, 0.063W, 0402
85 4 R16, R25, R87,
R125
10k CRCW040210K0JNED Vishay-Dale RES, 10k ohm, 5%, 0.063W, 0402
86 14 R17, R22, R26,
R50, R51, R56,
R57, R103, R106,
R109, R113,
R122, R126, R129
0 CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W, 0603
87 1 R18 29.4k CRCW040229K4FKED Vishay-Dale RES, 29.4 k, 1%, 0.063 W, 0402
88 7 R20, R74, R79,
R102, R107, R111,
R132
10.0k CRCW040210K0FKED Vishay-Dale RES, 10.0k ohm, 1%, 0.063W, 0402
89 2 R23, R105 34.0k CRCW040234K0FKED Vishay-Dale RES, 34.0 k, 1%, 0.063 W, 0402
90 1 R24 100 ERJ-2RKF1000X Panasonic RES, 100, 1%, 0.1 W, 0402
91 5 R27, R28, R37,
R88, R95
0 CRCW02010000Z0ED Vishay-Dale RES, 0, 5%, 0.05 W, 0201
92 1 R31 50 504L50R0FTNCFT AT Ceramics RES, 50, 1%, 0.125 W, AEC-Q200 Grade
1, 0402
93 3 R36, R52, R53 4.7k CRCW04024K70JNED Vishay-Dale RES, 4.7k ohm, 5%, 0.063W, 0402
94 1 R49 10.0k ERJ-2RKF1002X Panasonic RES, 10.0 k, 1%, 0.1 W, 0402
95 10 R58, R59, R70,
R77, R80, R81,
R89, R91, R101,
R104
220 CRCW0402220RJNED Vishay-Dale RES, 220, 5%, 0.063 W, 0402
96 1 R73 470 CRCW0402470RJNED Vishay-Dale RES, 470 ohm, 5%, 0.063W, 0402
97 3 R83, R100, R108 4.02k CRCW06034K02FKEA Vishay-Dale RES, 4.02 k, 1%, 0.1 W, 0603
98 1 R84 0 CRCW06030000Z0EA Vishay-Dale RES, 0, 5%, 0.1 W, 0603
99 1 R90 49.9 CRCW020149R9FKED Vishay-Dale RES, 49.9, 1%, 0.05 W, 0201
100 2 R92, R94 470 CRCW0402470RJNED Vishay-Dale RES, 470, 5%, 0.063 W, 0402
101 1 R93 22.1k CRCW040222K1FKED Vishay-Dale RES, 22.1k ohm, 1%, 0.063W, 0402
102 1 R96 49.9 ERJ-2RKF49R9X Panasonic RES, 49.9, 1%, 0.1 W, AEC-Q200 Grade
0, 0402
103 2 R97, R98 2.4k CRCW04022K40JNED Vishay-Dale RES, 2.4 k, 5%, 0.063 W, 0402
104 2 R99, R110 5.6k CRCW04025K60JNED Vishay-Dale RES, 5.6 k, 5%, 0.063 W, 0402
105 1 R114 10k CRCW040210K0JNED Vishay-Dale RES, 10 k, 5%, 0.063 W, 0402
106 1 R116 25.5k CRCW040225K5FKED Vishay-Dale RES, 25.5 k, 1%, 0.063 W, 0402
107 1 R117 95.3k CRCW040295K3FKED Vishay-Dale RES, 95.3 k, 1%, 0.063 W, 0402
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Table 17-1. DS90UB95x-Q1EVM BOM (continued)
ITEM QTY DESIGNATOR VALUE PART NUMBER MANUFACT
URER
DESCRIPTION
108 1 R118 39.2k CRCW040239K2FKED Vishay-Dale RES, 39.2 k, 1%, 0.063 W, 0402
109 2 R119, R120 78.7k CRCW040278K7FKED Vishay-Dale RES, 78.7 k, 1%, 0.063 W, 0402
110 1 R121 97.6k CRCW040297K6FKED Vishay-Dale RES, 97.6 k, 1%, 0.063 W, 0402
111 1 R127 1.87k CRCW04021K87FKED Vishay-Dale RES, 1.87k ohm, 1%, 0.063W, 0402
112 1 R128 4.99k CRCW04024K99FKED Vishay-Dale RES, 4.99k ohm, 1%, 0.063W, 0402
113 1 R131 33.2k CRCW040233K2FKED Vishay-Dale RES, 33.2 k, 1%, 0.063 W, 0402
114 2 R134, R135 33 CRCW040233R0JNED Vishay-Dale RES, 33 ohm, 5%, 0.063W, 0402
115 1 S1 EVQ-PSD02K Panasonic Switch, Tactile, SPST-NO, SMT
116 12 SH-J1, SH-J2, SH-
J3, SH-J4, SH-
J5, SH-J6, SH-J7,
SH-J8, SH-J9, SH-
J10, SH-J11, SH-
J12
1x2 2SN-BK-G Samtec Shunt, 2mm, Gold plated, Black
117 1 SW1 KSR221GLFS C and K
Components
Switch, Normally open, 2.3N force, 200k
operations, SMD
118 1 T1 ACM9070-701-2PL-TL01 TDK Coupled inductor, 5 A, 0.01 ohm, SMD
119 1 U1 TPD4E004DRYR Texas
Instruments
4-CHANNEL ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES,
DRY006A
120 1 U2 TPS73533DRBR Texas
Instruments
500mA, Low Quiescent Current, Ultra-Low
Noise, High PSRR Low-Dropout Linear
Regulator, DRB0008A
121 1 U3 TCA9406DCUR Texas
Instruments
TCA9406 Dual Bidirectional 1-MHz I2C-
BUS and SMBus Voltage Level-Translator,
1.65 to 3.6 V, -40 to 85 degC, 8-pin US8
(DCU), Green (RoHS & no Sb/Br)
122 1 U4 TPS54225PWPR Texas
Instruments
4.5V to 18V Input, 2-A Synchronous Step-
Down SWIFT™ Converter, PWP0014E
123 1 U5 DS90UB954TRGZRQ1 Texas
Instruments
FPD\Link III Deserializer with CSI\2
interface for 2.3MP/60fps cameras,
RGZ0048B (VQFN-48)
124 3 U6, U7, U8 LM2941LD/NOPB Texas
Instruments
1A Low Dropout Adjustable Regulator, 8-
pin LLP, Pb-Free
125 1 U9 TPS74801TDRCRQ1 Texas
Instruments
Single Output LDO, 1.5 A, Adjustable
0.8 to 3.6 V Output, 0.8 to 5.5 V Input,
with Programmable Soft Start, 10-pin SON
(DRC), -40 to 105 degC, Green (RoHS &
no Sb/Br)
126 1 U10 TPS767D318PWP Texas
Instruments
Dual Output LDO, 1 A, Fixed 1.8, 3.3 V
Output, 2.7 to 10 V Input, 28-pin HTSSOP
(PWP), -40 to 125 degC, Green (RoHS &
no Sb/Br)
127 1 U11 MSP430F5529IPN Texas
Instruments
25 MHz Mixed Signal Microcontroller with
128 KB Flash, 8192 B SRAM and 63
GPIOs, -40 to 85 degC, 80-pin QFP (PN),
Green (RoHS & no Sb/Br)
128 1 Y1 ABM3-25.000MHZ-D2W-T Abracon
Corportation
Crystal, 25 MHz, 18 pF, SMD
129 1 Y2 SG-210STF25.000000MHZY Epson OSC, 25 MHz, 1.6 to 3.6 V, SMD
130 1 Y3 ECS-240-20-5PX-TR ECS Inc. Crystal, 24.000MHz, 20pF, SMD
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18 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2019) to Revision B (April 2021) Page
• Updated Abstract section to include V3Link TDES954....................................................................................... 1
Changes from Revision * (August 2017) to Revision A (May 2019) Page
• Updated User's Guide throughout...................................................................................................................... 1
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WARNING
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
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3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
www.ti.com
4
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
5
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMER
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
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applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
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Copyright © 2021, Texas Instruments Incorporated
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