We take a look at the Digi XBee 3 BLU Development Kit from Digi International. It’s an easy-to-use platform that supports Bluetooth 5.4 Low Energy for industrial-grade wireless IoT applications.
Flameproof high-voltage anti-surge through-hole resistors from Stackpole.
In this Intro to ROS tutorial, we describe services and write our own custom server and client nodes using Python.
For this week’s Maker Update: a Superman robot made from plastic, machines to help you work out, a flying LED display, and animatronic nightmare fuel for your Halloween decorations.
This video demonstrates the essential operation of the Mantis ERGO 3D Stereo Microscopes, showing their ergonomic design, intuitive 3D viewing, versatile 3-lens turret, and precise functionality for professional and industrial inspection.
This video demonstrates the essential operation of the Mantis PIXO 3D Stereo Microscopes, showing their ergonomic design, intuitive 3D viewing, versatile 3-lens turret, and precise functionality for professional and industrial inspection.
Sintered Ferrite Powder, what makes this new material unique.
The Bar Type IPS TFT Displays are designed to be the solution for applications that require a smaller footprint display design.
Tomorrow Lab collaborates with Infineon to create a product using the PSOC 4000T Multi-Sense. The PSOC 4000T Multi-Sense is a platform that combines inductive sensing, capacitive sensing, and liquid level sensing in a single programmable chipset.
Discover our ultra-flexible and reliable FFC cables, designed for high-precision electronic applications in automotive, medical, and display industries.
This video discusses the RPCQ Series Automotive Grade Chip Resistors from Stackpole, highlighting its high power ratings and superior pulse handling.
Experience real-time AI acceleration on iWave’s iW-RainboW-G57D Versal VE2302 SoM with Mipsology Stack integration. Achieve high-performance, power efficient, low-latency edge inference and seamless AI model deployment using AMD’s Vitis AI platform.
Discover iWave’s high-performance SmartNIC solutions powered by Altera Agilex 7, AMD Zynq UltraScale+ MPSoC & RFSoC, and Achronix Speedster7t FPGAs enabling low-latency, AI-driven, and high-speed networking for data centers and edge applications.
MYIR's MYD-JX8MPQ development board centered around the MYC-JX8MPQ SOM and a base board, offering a complete evaluation platform for the NXP i.MX 8M Plus Processor based on 1.6 GHz Arm Cortex-A53 and 800MHz Cortex-M7 Cores.
Join iWave and DigiKey at Embedded World 2025 as Mr. Tawfeeq Ahmad from iWave discuss with Paige West from ES, FPGA System on Modules, AI, and networking trends, and how FPGA technology is transforming industries.
Explore iWave’s Zynq UltraScale+ RFSoC SoMs and rugged 3U VPX Cards ranging from ZU49/48/47/43/39/28/27/29/25 devices, built for high-performance signal processing, aerospace, and defense applications with scalable, reliable FPGA-based RF solutions.
This video discusses the Samtec AcceleRate® board-to-board and cable systems. It highlights their high-speed performance and ultra-compact designs. These interconnects are optimized for advanced networking, computing, and embedded applications.
With one of the industry's most diverse product portfolios—ranging from thermoelectric coolers and assemblies to temperature controllers, specialty pumps, and liquid cooling systems.
Discover iWave’s MediaTek Genio1200 OSM System on Module, a compact AI-powered SoM designed for AI-driven edge computing, immersive multimedia, and high-performance IoT applications, offering dual 4K displays, NPU acceleration, and rich connectivity.
MYIR's MYD-LR3576 Development Board centered around the MYC-LR3576 SOM and a base board, offering a complete evaluation platform for the Rockchip RK3576 (J) Processor based on 2.2 GHz Quad Cortex-A72 Cores and 1.8 GHz Quad Cortex-A53 Cores.