Product Highlights

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Image of Bergquist's SIL PAD® TSP 3500 SIL PAD® TSP 3500 Publish Date: 2024-04-11

Bergquist's SIL PAD TSP 3500 is a silicone elastomer formulated to maximize the dielectric and thermal performance.

Image of Bergquist's GAP FILLER TGF 3600 GAP FILLER TGF 3600 Publish Date: 2024-04-11

Bergquist's GAP FILLER TGF 3600 is a two-component, liquid gap-filling material featuring ultra-high thermal performance.

Image of Bergquist's Gap Pad® TGP 6000ULM Gap Pad® TGP 6000ULM Publish Date: 2020-04-16

Bergquist’s Gap Pad® TGP 6000ULM silicone-based, nonelectrically conductive Gap Pad is highly conformable, providing excellent coverage on various topographies.

Image of Bergquist's Gap Pad® TGP 7000 Gap Pad® TGP 7000ULM Publish Date: 2020-04-08

Bergquist’s Gap Pad® TGP 7000ULM soft gap-filling material is rated at 7.0 W/m-K and formulated for high-performance applications requiring low assembly stress.

Image of LOCTITE® STYCAST 2850FT Thermally Conductive Epoxy Encapsulant STYCAST 2850FT Thermally Conductive Epoxy Encapsulant Publish Date: 2020-01-02

LOCTITE STYCAST 2850FT thermally conductive epoxy encapsulant is designed to encapsulate components requiring heat dissipation and thermal shock properties.

Image of Henkel Bergquist's Gap Pad HC 5.0 Gap Pad HC 5.0 Publish Date: 2016-08-11

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Image of Bergquist's Sil-Pad® 900S Sil-Pad® 900S Publish Date: 2013-10-07

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

Image of Bergquist's Q-Pad® 3 Q-Pad® 3 Publish Date: 2013-10-07

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

Image of Bergquist's Gap Pad® 1500 Gap Pad® 1500 Publish Date: 2013-10-07

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

Image of Bergquist's Sil-Pad® K-10 Sil-Pad® K-10 Publish Date: 2013-10-07

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.

Image of Bergquist's Gap Pad® VO Ultra Soft Gap Pad® VO Ultra Soft Publish Date: 2013-10-07

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.