The HellermannTyton BundleTag is a one-piece, adhesive-backed label that displays critical tracking data and bar codes.
NEMA 5-15P to C13 Power Cord Family
Publish Date: 2026-04-24
The GlobTek NEMA 5-15P to C13 power cord family covers multiple SKUs with triple regional approval for North America (cULus), Japan (PSE), and Taiwan (BSMI).
Updated
LabVIEW Engineering Software
Updated: 2026-04-24
NI LabVIEW is a graphical programming environment that provides unique productivity accelerators for test system development.
4 Series NDIR Hydrocarbon Gas Sensor
Publish Date: 2026-04-24
Honeywell Sensing and Productivity Solutions sensors are designed for industrial safety, gas detection, emissions analysis/monitoring, and other relevant gas sensing applications.
PCIe® Gen 6 Mini Cool Edge 0.60 mm Card Edge Connectors
Publish Date: 2026-04-24
The Amphenol Communications Solutions PCIe® Gen 6 connector meets EDSFF E1/E3, SFF-A-1002, OCP NIC 3.0, GEN Z, and PCIe® enclosure compatible form factor (PECFF) specifications.
Conductonaut 1g Liquid Metal Thermal Compound
Publish Date: 2026-04-24
Conductonaut 1g is a liquid metal thermal compound from Thermal Grizzly that is designed for high-efficiency applications.
The MCC SICWT40120G6M SiC Schottky diode is optimized for demanding power systems requiring reliable operation under extreme conditions.
Updated
ecomate® Plastic Series Circular Connectors
Updated: 2026-04-23
Amphenol Sine Systems’ ecomate® plastic series circular connectors feature reduced dimensions and a robust design making them ideal for industrial applications.
3M™ extreme sealing tape+ is tough enough to handle sun, rain, snow, and extreme temperatures and is resistant to high-pressure washing.
IHLL Series Commercial and IHLP Series Automotive Power Inductors
Publish Date: 2026-04-23
Vishay Intertechnology IHLL commercial and IHLP automotive power inductors come in 2.0 mm x 1.6 mm x 1.2 mm 0806 and 3.2 mm x 2.5 mm x 1.2 mm 1210 case sizes.
Duronaut 2g Thermal Paste
Publish Date: 2026-04-22
Thermal Grizzly Duronaut 2 g thermal paste is safe to use on all electronic components, preventing any risk of short circuits during application.
Updated
Microphone Development Kit
Updated: 2026-04-22
Same Sky's microphone development kits each consist of four detachable evaluation circuits.
Automotive High Clearance/Creepage Distance Isolation Power Transformer - HCTSM1x Series
Publish Date: 2026-04-22
Bourns Magnetics Product Line Models HCTSM100308BAL, HCTSM110102HAL, and HCTSM110304HAL are high clearance/creepage distance isolation power transformers.
XRCGB Crystal Units
Publish Date: 2026-04-22
Murata XRCGB series supports wireless communications (Wi-Fi, BLE, NFC, Zigbee), wired interfaces (Ethernet, USB), and a wide array of electronic products.
TMS320C64 C64x Fixed Point DSP
Publish Date: 2026-04-22
Texas Instruments C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.
CRN Series Metal Thick-Film Resistors
Publish Date: 2026-04-22
Bourns CRN series metal thick-film resistors offer a durable and cost-efficient solution for electronic designs.
PFE1500FB Series AC/DC Power Modules
Publish Date: 2026-04-22
TDK-Lambda 1,500 W rated PFE1500FB AC/DC power modules are third-generation products accepting a wide 85 VAC to 305 VAC input range.
iDAQ-974 4-Slot Ethernet Chassis
Publish Date: 2026-04-22
The Advantech iDAQ-974-A expands the modular iDAQ portfolio with a 4-slot GbE industrial DAQ chassis designed for measurement and monitoring applications.
Altera FPGAs uniquely blend deterministic latency, parallel dataflow and reconfigurable I/O, making them ideal platforms for robotics teams.
DLC-T Round IPS TFT Display with Optional Capacitive Touch
Publish Date: 2026-04-22
DLC Display DLC-T round IPS TFT displays offer a versatile solution for a wide range of embedded applications.

