Stamped Heat Sinks for TO Packages

ATS introduces a comprehensive product line of stamped heat sinks, or board level cooling solutions, specifically designed to cool power modules that come in a variety of TO packages. TO packages are standard industry-set configurations that come in a wide variety of plastic or metal packages used for cooling transistors, thyristors, and IC’s with low pin counts. These lightweight heat sinks are a cost effective way to solve low power density thermal challenges. ATS stamped heat sinks are available in anodized aluminum, copper tin-plated, steel tin-plated or aluminum tin-plated materials. The solderable tabs allow for easy assembly in encapsulated and through-hole packages. Applications for the stamped heat sinks include a wide variety of TO packages, including TO-3, TO-5, TO-39, TO-92, TO-126, TO-127, TO-202, TO-218, TO-220, TO-247, TO-262, and TO-263.