Nexperia

MicroPak

MicroPak and MicroPak II packages from Nexperia create a smaller, slimmer design and frees up space for added functionality

Image of NXP Semiconductor's MicroPak™Nexperia's MicroPak and MicroPak II packages are the world's smallest packages for single-, dual-, and triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger pad size that provides a more rugged and reliable bond between the device and the PC board.

Ideally suited for portable applications, where board space is always a concern, MicroPak and MicroPak II packages create a smaller, slimmer design and frees up space for added functionality.

The form factor is similar to that of popular passive components and a variety of popular functions are available, including gates, flip-flops, single and dual buffers, inverters, configurable gates and translators.

Features
  • Incredibly small size enables even smaller system designs
  • MicroPak packages are 65% smaller than our smallest PicoGate packages
  • Highest contact-to-footprint ratio of any comparable package
  • An alternative to the Wafer-level Chip Scale Package (WCSP)
  • Leadless design eliminates problems from bent or non-planar leads
  • The same highly predictable Silicon as PicoGate
  • Operating temperature range: -40°C to +125°C
  • Automotive qualified: (JEDEC-STD-20C and Q100)
  • Lead-free for better environmental specifications
  • Most devices alternate-sourced for assured supply
  • Readily available in single, dual and triple gate configurations
  • Available in families that operate at 5 V, 3 V, 1 V and below
  • Packaged as 5 - 6 and 8-pin functions
  • MicroPak Package suffixes are GM, GT and GF

Applications

  • Mobile phones and PDAs
  • Laptop computers and high-density boards
  • Digital still cameras and MP3 players
  • Portable/handheld test and measurement and consumer equipment
Published: 2012-06-29