TAP-TP1 Thermal Pad

Product Highlights > TAP-TP1 Thermal Pad

            TAP-TP1 Thermal Pad
                    Ohmite’s high-performance TIM is designed for long life applications with extreme heat cycles and is made of flexible graphite
    

Ohmite's TAP-TP1 thermal interface material (TIM) pad is designed for applications requiring reliable performance, low contact resistance, long life, low maintenance, and high thermal conductivity. The flexible graphite materials are die-cut to ensure an exact fit and reduce module-to-module variation during assembly. The compressibility of the material improves surface contact, reducing thermal impedance. The material compression can compensate for flatness variations of up to 125 µm. The high in-plane thermal conductivity of this material reduces hot spots.

Ohmite’s high-performance TIM is designed for long life applications with extreme heat cycles and is made of flexible graphite specifically engineered for demanding power electronic applications.

Features

Consistent, reliable thermal performance enabling zero maintenance applications
Will not low or pump out under any thermal extremes, thermal cycles, power again and power cycling or part orientation
No degradation in performance from initial install and over the life of the application, reducing PM and improving MTTF
Assembly-ready foil form factor eliminates dispensing and cleaning processes
Easy installation removes the need for burn-in or re-torque, enabling a single step install
Minimal outgassing prevents fouling of optics in lighting applications

Applications

Power modules such as IGBT, RF devices used in UPS and inverters, motor drives, base stations/telecommunication, thermo electric devices, power supply modules, rectifiers, chargers, high-performance computers and servers, and EV/HEV/PHEV modules