Name: 342950-COPPER SKIVFIN
Brand: Boyd Laconia, LLC
SKU: 59-342950-COPPERSKIVFIN-ND
Price: 123.61318 NZD
Availability: OutOfStock

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342950-COPPER SKIVFIN
DigiKey Part Number	59-342950-COPPERSKIVFIN-ND
Manufacturer	Boyd Laconia, LLC
Manufacturer Product Number	342950-COPPER SKIVFIN
Description	342950,REV02(GP)
Manufacturer Standard Lead Time	16 Weeks
Customer Reference
Detailed Description	Heat Sink BGA, FPGA Copper Board Level
Datasheet	Datasheet

Product Attributes

Type	Description	Select All
Category	Fans, Blowers, Thermal Management Thermal Heat Sinks
Mfr	Boyd Laconia, LLC
Series	-
Packaging	Bulk
Part Status	Active
Type	Board Level
Package Cooled	BGA, FPGA
Attachment Method	Push Pin, Thermal Material
Shape	Square, Fins
Length	3.543" (90.00mm)
Width	3.543" (90.00mm)
Diameter	-
Fin Height	0.394" (10.00mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	-
Material	Copper
Material Finish	-

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This product is not kept in stock at DigiKey. The lead time shown will apply to the manufacturer’s shipment to DigiKey. Upon receiving the product, DigiKey will ship to fill open orders.

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Bulk