To maximize the coupling between the Hall transducer and the magnetic field generated by the current to be sensed, Allegro has developed a patented packaging technique that fully integrates the conductor and the sensor IC into a single, over molded IC package. The green arrows in figure (A) represent the bidirectional flow of current through the low resistance, ACS710 primary current path, shown clearly in figure (B). Figure (B) also shows how the current path is precisely oriented to create a partial current loop at the Hall element location. This design allows for an extremely compact sensor solution while at the same time bringing the primary conductor in extremely close proximity with the Hall element. The close proximity maximizes the strength of the magnetic field at the Hall element location thereby increasing device accuracy. Flip chip assembly of the device, explained in detail on the next slide, is the final innovation that increases magnetic coupling.