LFPAK Bipolar Transistors

Product Highlights > LFPAK Bipolar Transistors

            LFPAK Bipolar Transistors
                    Nexperia's first bipolar transistors in LFPAK / Power-SO8
    

Image of NXP Semiconductor's LFPAK Bipolar Transistors Nexperia now offers the first high-power bipolar transistors housed in a LFPAK56 (Power-SO8) package. They deliver DPAK-like thermal and electrical performance in just half the footprint. Offering reliable, energy-efficient performance, they are AEC-Q101 qualified and support high-temperature operation up to 175°C. Nexperia will further grow their portfolio in 2014 and offer 25 types, up to 100 V and 15 A, in single and double configurations. These bipolar transistors offer space-saving 5 mm x 6 mm package outlines and low profiles of 1 mm, along with high power dissipation (P_tot).

Features

Suitable for high-temperature applications (175°C)
High reliability and mechanical ruggedness thanks to solid copper clip (no wires)
High energy efficiency due to less heat generation
AEC-Q101 qualified
Future-proof, growing portfolio

Applications

Power management
Motor drives
Loadswitches
Linear mode voltage regulators
Backlighting applications

Available in tape-and-reel (-2-ND), cut tape (-1-ND), and custom Digi-Reel^® (-6-ND).

Download Nexperia's LFPAK product brochure

Nexperia LFPAK Types and Competitor Crosses

Nexperia Type (LFPAK)	Electric Parameter (V_CEO, I_C, I_CM, h_FE min/typ)	Name (Competitor Type)	Electric Parameter (Competitor Type)	Package (Competitor Type)
PHPT60603PY	60 V, 3 A, 8 A, 200/400	MJD32 (ON, ST, Fairchild)	PNP, 40 V, 3 A	DPAK
PHPT60603NY	60 V, 3 A, 8 A, 200/400	MJD31 (ON, ST, Fairchild)	NPN, 40 V, 3 A	DPAK
PHPT61003PY	100 V, 3 A, 8 A, 150/220	MJD32C (ON, ST, Fairchild)	PNP, 100 V, 3 A	DPAK
PHPT61003NY	100 V, 3 A, 8 A, 150/250	MJD31C (ON, ST, Fairchild)	NPN, 100 V, 3 A	DPAK
PHPT61002PYC	100 V, 2 A, 6 A, 150/220	2SA2205 (ON, Sanyo)	PNP, 100 V, 3 A	DPAK
PHPT61002NYC	100 V, 2 A, 6 A, 150/250	2SC6099 (ON, Sanyo)	NPN, 100 V, 3 A	DPAK

LFPAK56 vs. DPAK

LFPAK56 - the true power package: Get DPAK-like performance in half the footprint

Parameter	LFPAK56	DPAK
Reliability / mechanical ruggedness	Designed for reliability: solid copper clip, wire-free	Wire bonding prone to breakage
Outline	5 x 6 mm²	10 x 7 mm²
Height	1mm	2.3 mm
Occupied area on PCB	30 mm²	70 mm²
Max. temperature of complete portfolio	175°C	150°C