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thermal1

In general, packages without thermal pads would be limited to 300 to 400 milliwatts of power dissipation in a room temperature environment. Reliability is diminished at high die temperatures; therefore, it is desirable to have a die temperature below 125°C for average systems. Applications working with a high VIN can easily exceed the package thermal capability well before the rated output current is reached.

PTM Published on: 2019-08-08