Power subsystem designers with the task of designing power systems with multiple power rails will benefit from the simplicity of implementing Renesas' power modules. This slide illustrates the various sections of a high-speed network card. The power system (circled in yellow) is pushed far to the right of the PCB board in favor of more memory or other components. Requiring very little space, Renesas' power module technology allows power designers to implement multiple high-current power supply systems in a very small PCB board area. Renesas' packaging technology enables smaller solutions while actually increasing the power density. By implementing integrated power supply module solutions to power the many power rails in this example, designers save hundreds of dollars in man hours in development and PCB layout time due to the small power packaging density without the need for heat sinks or fans.