Important factors in RF design and how they effect design tradeoffs are listed on this slide. Quality factor is an important parameter in RF design, a higher quality factor in passives results in less thermal dissipation and more predictable behavior over frequency. Size reduction through IPD comes from being able to integrate multiple RF functions into one device. Reduced die size is desirable today as electronic devices are becoming smaller and require more RF content. The faster the design turnaround, the shorter the overall design cycle. Finally, having powerful SW design tools helps simulate device level performance, for instance taking into account package parasitics.