Some applications require the smallest possible solution size and Texas Instruments is offering a wide range of power solutions in tiny Chip-Scale-Packages (WCSP). However, not all users like this BGA-type package with extreme fine pitches but would prefer to use QFN-packaged ICs. Using QFN-packages enables them to use lower cost PCB material and manufacturing equipment. Texas Instruments’ HotRod™ package option combines the best of QFN and WCSP, offering an easy-to-use package that is still giving a very small solution. In addition, the wire-bonds of a standard QFN package are eliminated. This is reducing power losses, giving lower inductance and lower resistance inside the IC. Users will benefit with an improved thermal performance that minimizes the temperature increase. Higher power density and improved system reliability are direct effects of this package innovation. It may even help some users to eliminate the need for airflow or a fan in the application.